Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Pei-Wei Wang | 2023-01-24 |
| 11540396 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Ra-Min Tain | 2022-12-27 |
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Pei-Wei Wang | 2021-10-12 |
| 7261654 | Extendable bat | — | 2007-08-28 |
| 6057601 | Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate | John Hon-Shing Lau, Tzyy-Jang Tseng | 2000-05-02 |