SL

Shao-Chien Lee

UT Unimicron Technology: 18 patents #15 of 284Top 6%
Overall (All Time): #249,554 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
12052815 Manufacturing method of circuit board Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching-Shiang Chang, Ming-Ting Chang +3 more 2024-07-30
11991824 Circuit board structure and manufacturing method thereof Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Ming-Ru Chen +1 more 2024-05-21
11785707 Circuit board and manufacturing method thereof and electronic device Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching-Shiang Chang, Ming-Ting Chang +3 more 2023-10-10
11737209 Circuit board and manufacturing method thereof and electronic device Chih-Chiang Lu, Chi-Min Chang, Jun-Rui Huang, Ming-Ting Chang 2023-08-22
11665832 Circuit board structure and manufacturing method thereof John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang +2 more 2023-05-30
11641720 Circuit board and manufacturing method thereof Pei-Wei Wang, Ra-Min Tain, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang +1 more 2023-05-02
11600936 Circuit board structure Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Kuo-Wei Li 2023-03-07
11540396 Circuit board structure and manufacturing method thereof Tzyy-Jang Tseng, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain 2022-12-27
11114782 Method of manufacturing circuit board structure Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Kuo-Wei Li 2021-09-07
10939538 Circuit board structure Ming-Hao Wu 2021-03-02
10736215 Multilayer circuit board structure and manufacturing method thereof Ming-Hao Wu, Zong-Hua Li 2020-08-04
10497847 Structure and manufacturing method of heat dissipation substrate and package structure and method thereof Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li 2019-12-03
10159151 Chip package circuit board module Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li, Chien-Tsai Li 2018-12-18
10056356 Chip package circuit board module Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li 2018-08-21
8590147 Method for fabricating circuit board structure with concave conductive cylinders Chih-Ming Chang 2013-11-26
8091221 Method of fabricating circuit board Chih-Ming Chang 2012-01-10
7667144 Circuit board and method of fabricating the same Chih-Ming Chang 2010-02-23
7393720 Method for fabricating electrical interconnect structure Tzyy-Jang Tseng, Chang-Ming Lee 2008-07-01