Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414243 | Manufacturing method of package structure | Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2025-09-09 |
| 12369250 | Circuit board structure and manufacturing method thereof | Ping-Tsung Lin, Chia-Yu Peng, Pu-Ju Lin, Cheng-Ta Ko | 2025-07-22 |
| 12300844 | Battery module | Yuwen Wang, Guangliang LIN | 2025-05-13 |
| 12266616 | Integrated circuit package structure | Chia-Yu Peng, John Hon-Shing Lau | 2025-04-01 |
| 12255279 | Light-emitting diode package structure and manufacturing method thereof | Wen-Yu Lin | 2025-03-18 |
| 12218017 | Glass carrier having protection structure and manufacturing method thereof | Wen-Yu Lin, Pu-Ju Lin | 2025-02-04 |
| 12160953 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, Cheng-Ta Ko, Pu-Ju Lin | 2024-12-03 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Chen-Hao Lin, Pu-Ju Lin, Cheng-Ta Ko, Chin-Sheng Wang +2 more | 2024-03-26 |
| 11895780 | Manufacturing method of package structure | Chen-Hao Lin, Wang-Hsiang Tsai, Cheng-Ta Ko | 2024-02-06 |
| 11824012 | Integrated circuit package structure and method of manufacturing the same | Chia-Yu Peng, John Hon-Shing Lau | 2023-11-21 |
| 11764344 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo | 2023-09-19 |
| 11764120 | Chip packaging structure and manufacturing method thereof | Chia-Yu Peng, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chia-Yu Peng, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11697594 | Method for recycling spent carbon cathode of aluminum electrolysis | Yanqing Lai, Zhongliang Tian, Yifan Li, Peiyu Gong, Bo Ki Hong +1 more | 2023-07-11 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Chia-Yu Peng +1 more | 2023-06-20 |
| 11682658 | Light-emitting package and method of manufacturing the same | Chen-Hao Lin, Chia-Hao Chang, Tzu-Nien LEE | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Chia-Yu Peng +2 more | 2023-05-30 |
| 11637047 | Manufacturing method of chip package structure | Pu-Ju Lin, Cheng-Ta Ko | 2023-04-25 |
| 11541493 | Multi-axis mechanism device | — | 2023-01-03 |
| 11523503 | Wiring board and method of forming hole thereof | Chen-Hao Lin, Bo-Cheng Lin | 2022-12-06 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, John Hon-Shing Lau, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |
| 11476234 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Chi-Hai Kuo, Cheng-Ta Ko | 2022-10-18 |
| 11462452 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko | 2022-10-04 |
| 11445617 | Package structure and manufacturing method thereof | Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-09-13 |
| 11424216 | Electronic device bonding structure and fabrication method thereof | Chia-Fu Hsu, Pu-Ju Lin, Cheng-Ta Ko | 2022-08-23 |