Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369250 | Circuit board structure and manufacturing method thereof | Ping-Tsung Lin, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko | 2025-07-22 |
| 12266616 | Integrated circuit package structure | Kai-Ming Yang, John Hon-Shing Lau | 2025-04-01 |
| 12160953 | Circuit board structure and manufacturing method thereof | Kai-Ming Yang, Cheng-Ta Ko, Pu-Ju Lin | 2024-12-03 |
| 11824012 | Integrated circuit package structure and method of manufacturing the same | Kai-Ming Yang, John Hon-Shing Lau | 2023-11-21 |
| 11764120 | Chip packaging structure and manufacturing method thereof | Kai-Ming Yang, Pei-Chi Chen, Pu-Ju Lin, Cheng-Ta Ko | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang +2 more | 2023-05-30 |
| 11516910 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |