Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12250776 | Substrate structure and cutting method thereof | Jeng-Ting Li, Cheng-Ta Ko, Pu-Ju Lin | 2025-03-11 |
| 12185479 | Flexible circuit board and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Shih-Chieh Chen, Jeng-Ting Li | 2024-12-31 |
| 12062742 | Package structure and manufacturing method of the same | Hao-Wei Tseng, Jeng-Ting Li, Ying Chen, Pu-Ju Lin, Cheng-Ta Ko | 2024-08-13 |
| 11991824 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Shao-Chien Lee, Ming-Ru Chen +1 more | 2024-05-21 |
| 11955587 | Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device | Jeng-Ting Li, Cheng-Ta Ko, Pu-Ju Lin | 2024-04-09 |
| 11764344 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng +1 more | 2023-07-25 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng +2 more | 2023-05-30 |
| 11476234 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Kai-Ming Yang, Cheng-Ta Ko | 2022-10-18 |
| 11460255 | Vapor chamber device and manufacturing method thereof | Pu-Ju Lin, Ying Chen, Wei-Ci Ye, Cheng-Ta Ko | 2022-10-04 |