Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369250 | Circuit board structure and manufacturing method thereof | Ping-Tsung Lin, Kai-Ming Yang, Chia-Yu Peng, Cheng-Ta Ko | 2025-07-22 |
| 12250776 | Substrate structure and cutting method thereof | Jeng-Ting Li, Chi-Hai Kuo, Cheng-Ta Ko | 2025-03-11 |
| 12243838 | Circuit substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, John Hon-Shing Lau | 2025-03-04 |
| 12218017 | Glass carrier having protection structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang | 2025-02-04 |
| 12185479 | Flexible circuit board and manufacturing method thereof | Cheng-Ta Ko, Shih-Chieh Chen, Chi-Hai Kuo, Jeng-Ting Li | 2024-12-31 |
| 12160953 | Circuit board structure and manufacturing method thereof | Kai-Ming Yang, Chia-Yu Peng, Cheng-Ta Ko | 2024-12-03 |
| 12062742 | Package structure and manufacturing method of the same | Hao-Wei Tseng, Chi-Hai Kuo, Jeng-Ting Li, Ying Chen, Cheng-Ta Ko | 2024-08-13 |
| 11991824 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Chi-Hai Kuo, Shao-Chien Lee, Ming-Ru Chen +1 more | 2024-05-21 |
| 11955587 | Light emitting diode package structure and manufacturing method thereof and manufacturing method of display device | Jeng-Ting Li, Chi-Hai Kuo, Cheng-Ta Ko | 2024-04-09 |
| 11943877 | Circuit board structure and manufacturing method thereof | Wen-Yu Lin, Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, Chin-Sheng Wang +2 more | 2024-03-26 |
| 11764120 | Chip packaging structure and manufacturing method thereof | Kai-Ming Yang, Chia-Yu Peng, Pei-Chi Chen, Cheng-Ta Ko | 2023-09-19 |
| 11764344 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng, Cheng-Ta Ko, Chi-Hai Kuo, Kai-Ming Yang | 2023-09-19 |
| 11710690 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Kai-Ming Yang, Chia-Yu Peng, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11690180 | Manufacturing method of carrier structure | Tzyy-Jang Tseng, Cheng-Ta Ko, Tse-Wei Wang | 2023-06-27 |
| 11682612 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Kai-Ming Yang, Chi-Hai Kuo, Chia-Yu Peng +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Chi-Hai Kuo, Kai-Ming Yang, Chia-Yu Peng +2 more | 2023-05-30 |
| 11637047 | Manufacturing method of chip package structure | Kai-Ming Yang, Cheng-Ta Ko | 2023-04-25 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, John Hon-Shing Lau, Kai-Ming Yang, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |
| 11488900 | Wiring board with interposer substrate surrounded by underfill and embedded in main substrate and method of fabricating the same | Yan-Jia Peng, Kuo-Ching Chen | 2022-11-01 |
| 11476234 | Chip package structure and manufacturing method thereof | Chi-Hai Kuo, Kai-Ming Yang, Cheng-Ta Ko | 2022-10-18 |
| 11460255 | Vapor chamber device and manufacturing method thereof | Ying Chen, Wei-Ci Ye, Chi-Hai Kuo, Cheng-Ta Ko | 2022-10-04 |
| 11462452 | Chip package structure and manufacturing method thereof | Kai-Ming Yang, Cheng-Ta Ko | 2022-10-04 |
| 11424216 | Electronic device bonding structure and fabrication method thereof | Chia-Fu Hsu, Kai-Ming Yang, Cheng-Ta Ko | 2022-08-23 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Tzyy-Jang Tseng, Ra-Min Tain, Kai-Ming Yang | 2022-08-09 |
| 11410971 | Chip package structure | Tzyy-Jang Tseng, Cheng-Ta Ko, Ra-Min Tain | 2022-08-09 |