Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412879 | Package structure and manufacturing method thereof | Tzyy-Jang Tseng | 2025-09-09 |
| 12414243 | Manufacturing method of package structure | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2025-09-09 |
| 12309943 | Circuit carrier and manufacturing method thereof and package structure | Ra-Min Tain, Cheng-Ta Ko, Tzyy-Jang Tseng, Chun-Hsien Chien | 2025-05-20 |
| 12266616 | Integrated circuit package structure | Kai-Ming Yang, Chia-Yu Peng | 2025-04-01 |
| 12243838 | Circuit substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Pu-Ju Lin, Cheng-Ta Ko | 2025-03-04 |
| 11860428 | Package structure and optical signal transmitter | Tzyy-Jang Tseng | 2024-01-02 |
| 11824012 | Integrated circuit package structure and method of manufacturing the same | Kai-Ming Yang, Chia-Yu Peng | 2023-11-21 |
| 11808787 | Probe card testing device | Tzyy-Jang Tseng, Kuo Ching Tien, Ra-Min Tain | 2023-11-07 |
| 11710690 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chia-Yu Peng, Chi-Hai Kuo +1 more | 2023-07-25 |
| 11682612 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo, Chia-Yu Peng +1 more | 2023-06-20 |
| 11665832 | Circuit board structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang, Chia-Yu Peng +2 more | 2023-05-30 |
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang | 2023-01-24 |
| 11540396 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Shao-Chien Lee, Chen-Hua Cheng, Ra-Min Tain | 2022-12-27 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |
| 11445617 | Package structure and manufacturing method thereof | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-09-13 |
| 11410933 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Tzyy-Jang Tseng, Ra-Min Tain, Kai-Ming Yang | 2022-08-09 |
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng, Pei-Wei Wang | 2021-10-12 |
| 9583366 | Thermally-enhanced provision of underfill to electronic devices using a stencil | Qinglong Zhang, Ming-Yang Li, Michael Zahn, Yiu Ming Cheung | 2017-02-28 |
| 9385056 | Packaging substrate having embedded interposer and fabrication method thereof | Dyi-Chung Hu | 2016-07-05 |
| 9252054 | Thinned integrated circuit device and manufacturing process for the same | Sheng-Tsai Wu, Heng-Chieh Chien, Yu-Lin Chao, Wei-Chung Lo | 2016-02-02 |
| 8674491 | Semiconductor device | Chun-Kai Liu, Ming-Ji Dai, Ra-Min Tain | 2014-03-18 |
| 8673658 | Fabricating method of semiconductor device | Ming-Che Hsieh, Ra-Min Tain | 2014-03-18 |
| 8536701 | Electronic device packaging structure | Ra-Min Tain, Ming-Ji Dai | 2013-09-17 |
| 8519524 | Chip stacking structure and fabricating method of the chip stacking structure | Sheng-Tsai Wu, Heng-Chieh Chien, Ra-Min Tain, Ming-Ji Dai, Yu-Lin Chao | 2013-08-27 |
| 8502224 | Measuring apparatus that includes a chip having a through silicon via, a heater, and a stress sensor | Ra-Min Tain, Ming-Che Hsieh, Wei Li, Ming-Ji Dai | 2013-08-06 |