Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309943 | Circuit carrier and manufacturing method thereof and package structure | John Hon-Shing Lau, Ra-Min Tain, Cheng-Ta Ko, Tzyy-Jang Tseng | 2025-05-20 |
| 12292468 | Inspection system and inspection method of bare circuit board | Hsin-Hung Lee, Hsuan-Yu Lai, Yu-Chung Hsieh | 2025-05-06 |
| 12219711 | Bare circuit board | Hsin-Hung Lee, Hsuan-Yu Lai, Yu-Chung Hsieh, Hung-Pin Yu | 2025-02-04 |
| 11678441 | Manufacturing method of circuit carrier board structure | Wei-Ti Lin, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain | 2023-06-13 |
| 11579178 | Inspection apparatus for bare circuit board | Hsin-Hung Lee, Yu-Chung Hsieh, Yi-Hsiu Fang, Tzyy-Jang Tseng | 2023-02-14 |
| 11532543 | Manufacturing method of package carrier | Wei-Ti Lin, Yu-Hua Chen | 2022-12-20 |
| 11348869 | Method of manufacturing chip packaging structure | Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin | 2022-05-31 |
| 11251350 | Light-emitting diode package and manufacturing method thereof | Yi-Cheng Lin, Yu-Hua Chen, Chien-Chou Chen, Cheng-Hui Wu | 2022-02-15 |
| 11201123 | Substrate structure and manufacturing method thereof | Po-Chen Lin, Wen-Liang Yeh, Chien-Chou Chen | 2021-12-14 |
| 11139234 | Package carrier and manufacturing method thereof | Wei-Ti Lin, Yu-Hua Chen | 2021-10-05 |
| 11037869 | Package structure and preparation method thereof | Fu-Yang Chen, Cheng-Hui Wu, Wei-Ti Lin | 2021-06-15 |
| 11032917 | Circuit carrier board and manufacturing method thereof | Wei-Ti Lin, Fu-Yang Chen | 2021-06-08 |
| 10999939 | Circuit carrier board and manufacturing method thereof | Wen-Liang Yeh, Wei-Ti Lin | 2021-05-04 |
| 10950687 | Manufacturing method of substrate structure | Yu-Hua Chen, Fu-Yang Chen, Chien-Chou Chen, Wei-Ti Lin | 2021-03-16 |
| 10937723 | Package carrier structure having integrated circuit design and manufacturing method thereof | Yu-Chung Hsieh, Yu-Hua Chen | 2021-03-02 |
| 10886264 | Manufacturing method of light-emitting diode package structure | Wei-Ti Lin, Fu-Yang Chen | 2021-01-05 |
| 10888001 | Circuit carrier board structure and manufacturing method thereof | Wei-Ti Lin, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain | 2021-01-05 |
| 10879167 | Chip packaging structure and manufacturing method thereof | Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin | 2020-12-29 |
| 10863618 | Composite substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Pei-Wei Wang, Bo-Cheng Lin, Chien-Chou Chen | 2020-12-08 |
| 10797017 | Embedded chip package, manufacturing method thereof, and package-on-package structure | Po-Chen Lin, Ra-Min Tain, Chien-Chou Chen | 2020-10-06 |
| 10700161 | Substrate structure and manufacturing method thereof | Yu-Hua Chen, Fu-Yang Chen, Chien-Chou Chen, Wei-Ti Lin | 2020-06-30 |
| 10700049 | Light-emitting diode package structure and manufacturing method thereof | Wei-Ti Lin, Fu-Yang Chen | 2020-06-30 |
| 10660202 | Carrier structure and manufacturing method thereof | Wen-Liang Yeh, Chien-Chou Chen, Cheng-Hui Wu | 2020-05-19 |
| 10461146 | Package structure and manufacturing method thereof | Wen-Liang Yeh, Chien-Chou Chen, Cheng-Hui Wu | 2019-10-29 |
| 10123418 | Circuit board structure and manufacturing method thereof | Wei-Ti Lin, Fu-Yang Chen | 2018-11-06 |