Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381133 | Power semiconductor device | Tai-Jyun Yu, Kuo-Shu Kao, Han-Lin Wu, Tai-Kuang Lee, Jing-Yao Chang | 2025-08-05 |
| 12074137 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2024-08-27 |
| 12009341 | Integrated antenna package structure | Po-Kai Chiu, Yu-Min Lin, Wen-Hung Liu, Ang-Ying Lin, Chang-Sheng Chen | 2024-06-11 |
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Wei-Chung Lo, Tao-Chih Chang, Yu-Min Lin | 2023-12-26 |
| 11646270 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Yu-Min Lin, Shin-Yi Huang, Yuan-Yin Lo, Tzu-Hsuan Ni +1 more | 2023-05-09 |
| 11587905 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2023-02-21 |
| D976852 | Power module | Hsin-Han Lin, Yuan-Yin Lo, Kuo-Shu Kao, Tai-Jyun Yu, Han-Lin Wu +1 more | 2023-01-31 |
| 11569217 | Image sensor package and manufacturing method thereof | Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2023-01-31 |
| 11424190 | Multi-chip package and manufacture method thereof | Chao-Jung Chen, Yu-Min Lin, Shin-Yi Huang, Ang-Ying Lin, Tzu-Hsuan Ni +1 more | 2022-08-23 |
| 11251174 | Image sensor package and manufacturing method thereof | Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2022-02-15 |
| 11004816 | Hetero-integrated structure | Yu-Min Lin, Ang-Ying Lin, Tao-Chih Chang, Wei-Chung Lo | 2021-05-11 |
| 10540474 | Chip temperature computation method and chip temperature computation device | Heng-Chieh Chien, Ming-Ji Dai, Chih-Ming Shen | 2020-01-21 |
| 10390390 | Electronic apparatus and light-emitting module driving circuit thereof | Chun-Hsien Chen, Yi-Chun Chou | 2019-08-20 |
| 9448121 | Measurement method, measurement apparatus, and computer program product | Heng-Chieh Chien, Ming-Ji Dai, Huey-Lin Hsieh, Jing-Yi Huang | 2016-09-20 |
| 9252054 | Thinned integrated circuit device and manufacturing process for the same | Heng-Chieh Chien, John Hon-Shing Lau, Yu-Lin Chao, Wei-Chung Lo | 2016-02-02 |
| 8519524 | Chip stacking structure and fabricating method of the chip stacking structure | John Hon-Shing Lau, Heng-Chieh Chien, Ra-Min Tain, Ming-Ji Dai, Yu-Lin Chao | 2013-08-27 |