Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12401387 | Electronic module | Shih-Wen Lu, Chun-Jen Chen, Po-Hsiang Tseng, Ming-Lun Yu | 2025-08-26 |
| 12349293 | Combined power module | Yuan-Cheng Huang, I-Hung Chiang, Ji-Yuan Syu, Po-Kai Chiu, Kuo-Shu Kao | 2025-07-01 |
| 11876551 | Electronic module | Shih-Wen Lu, Chun-Jen Chen, Po-Hsiang Tseng, Ming-Lun Yu | 2024-01-16 |
| D976852 | Power module | Sheng-Tsai Wu, Yuan-Yin Lo, Kuo-Shu Kao, Tai-Jyun Yu, Han-Lin Wu +1 more | 2023-01-31 |
| 11239168 | Chip package structure | Yu-Min Lin, Tao-Chih Chang | 2022-02-01 |
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Tao-Chih Chang, Kuo-Shu Kao, Fang-Jun Leu, Chih-Ming Tzeng +2 more | 2020-06-02 |