Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074137 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni +1 more | 2024-08-27 |
| 11646270 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Yu-Min Lin, Shin-Yi Huang, Sheng-Tsai Wu, Tzu-Hsuan Ni +1 more | 2023-05-09 |
| 11587905 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni +1 more | 2023-02-21 |
| D976852 | Power module | Sheng-Tsai Wu, Hsin-Han Lin, Kuo-Shu Kao, Tai-Jyun Yu, Han-Lin Wu +1 more | 2023-01-31 |
| 11569217 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yu-Min Lin, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2023-01-31 |
| 11424190 | Multi-chip package and manufacture method thereof | Chao-Jung Chen, Yu-Min Lin, Sheng-Tsai Wu, Shin-Yi Huang, Ang-Ying Lin +1 more | 2022-08-23 |
| 11251174 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yu-Min Lin, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2022-02-15 |