Issued Patents All Time
Showing 1–25 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12339161 | Ambient light sensing method and ambient light sensor | — | 2025-06-24 |
| 12241688 | Vapor-phase/liquid-phase fluid heat exchange unit | Chih-Peng Chen | 2025-03-04 |
| 12102542 | Interspinous spacer and methods and systems utilizing the interspinous spacer | — | 2024-10-01 |
| 12074137 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2024-08-27 |
| 12027470 | Package carrier having a stiffener between solder bumps | Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Ang-Ying Lin, Po-Chih Chang | 2024-07-02 |
| 12013284 | Optical sensor module and packaging method thereof | Feng-Jung Hsu | 2024-06-18 |
| 12009341 | Integrated antenna package structure | Po-Kai Chiu, Sheng-Tsai Wu, Wen-Hung Liu, Ang-Ying Lin, Chang-Sheng Chen | 2024-06-11 |
| 11942396 | Heterogeneous integration semiconductor package structure | Heng-Chieh Chien, Shu-Jung Yang, Chih-Yao Wang, Yu-Lin Chao | 2024-03-26 |
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Wei-Chung Lo, Tao-Chih Chang, Sheng-Tsai Wu | 2023-12-26 |
| 11775878 | Automated machine learning test system | Yan Gao, Joshua David Griffin, Bengt Wisen Pederson, Ricky Dee Tharrington, Jr., Pei-Yi Tan +1 more | 2023-10-03 |
| 11646270 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Shin-Yi Huang, Sheng-Tsai Wu, Yuan-Yin Lo, Tzu-Hsuan Ni +1 more | 2023-05-09 |
| 11635988 | Optimal number of threads determination system | Yan Gao, Joshua David Griffin, Yan Xu, Seyedalireza Yektamaram, Amod Anil Ankulkar +5 more | 2023-04-25 |
| 11630114 | Method for quantitative measurement of catechol estrogen bound protein in blood sample | Shu-Hui Chen, Yu Huang, Hung-Hsiang Jen | 2023-04-18 |
| 11587905 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2023-02-21 |
| 11569217 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2023-01-31 |
| 11555653 | Vapor/liquid condensation system | Chih-Peng Chen | 2023-01-17 |
| 11538842 | Chip scale package structures | Tao-Chih Chang | 2022-12-27 |
| 11424190 | Multi-chip package and manufacture method thereof | Chao-Jung Chen, Sheng-Tsai Wu, Shin-Yi Huang, Ang-Ying Lin, Tzu-Hsuan Ni +1 more | 2022-08-23 |
| 11355472 | Package structure and method for connecting components | Tao-Chih Chang, Wei-Chung Lo | 2022-06-07 |
| 11326836 | Vapor/liquid condensation system | Chih-Peng Chen | 2022-05-10 |
| 11258378 | Piezoelectric apparatus for motorization | Chih-Kung Lee, Yu-Hsiang Hsu, Wen-Jong Wu, Tsung-Yu Chu | 2022-02-22 |
| 11251174 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2022-02-15 |
| 11239168 | Chip package structure | Hsin-Han Lin, Tao-Chih Chang | 2022-02-01 |
| 11158142 | Method for tire force reserve estimation | Bo-Chiuan Chen, Ya-Yu You, Wei Chen, Yuan-Chun Chen, Di Ku | 2021-10-26 |
| 11159251 | Antenna control method and communication system control method | Chien-Sheng Chen | 2021-10-26 |