Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12074137 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2024-08-27 |
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ren-Shin Cheng, Po-Chih Chang | 2024-07-02 |
| 12009341 | Integrated antenna package structure | Po-Kai Chiu, Sheng-Tsai Wu, Yu-Min Lin, Wen-Hung Liu, Chang-Sheng Chen | 2024-06-11 |
| 11646270 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Shin-Yi Huang, Sheng-Tsai Wu, Yuan-Yin Lo, Tzu-Hsuan Ni +1 more | 2023-05-09 |
| 11587905 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2023-02-21 |
| 11569217 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2023-01-31 |
| 11424190 | Multi-chip package and manufacture method thereof | Chao-Jung Chen, Yu-Min Lin, Sheng-Tsai Wu, Shin-Yi Huang, Tzu-Hsuan Ni +1 more | 2022-08-23 |
| 11251174 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2022-02-15 |
| 11004816 | Hetero-integrated structure | Yu-Min Lin, Sheng-Tsai Wu, Tao-Chih Chang, Wei-Chung Lo | 2021-05-11 |