Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027470 | Package carrier having a stiffener between solder bumps | Yu-Min Lin, Ching-Kuan Lee, Chao-Jung Chen, Ang-Ying Lin, Po-Chih Chang | 2024-07-02 |
| 11239141 | Lead frame package | Shih-Hsien Wu, Yu-Wei Huang, Chih-Ming Shen, Yi-Chieh TSAI | 2022-02-01 |
| 9706656 | Signal transmission board and method for manufacturing the same | Chien-Min Hsu, Shih-Hsien Wu, Jing-Yao Chang, Tao-Chih Chang, Min-Lin Lee | 2017-07-11 |