Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Wei-Chung Lo, Yu-Min Lin, Sheng-Tsai Wu | 2023-12-26 |
| 11776867 | Chip package | Kuo-Shu Kao, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2023-10-03 |
| 11756858 | Power module with housing having bending sections | Wei Han, Chia-Yen Lee, Jing-Yao Chang | 2023-09-12 |
| 11538842 | Chip scale package structures | Yu-Min Lin | 2022-12-27 |
| 11387159 | Chip package | Kuo-Shu Kao, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2022-07-12 |
| 11355472 | Package structure and method for connecting components | Yu-Min Lin, Wei-Chung Lo | 2022-06-07 |
| 11239211 | Electronic device having a curved portion between a plurality of conductive portions on a substrate | Wei Han, Jing-Yao Chang | 2022-02-01 |
| 11239168 | Chip package structure | Hsin-Han Lin, Yu-Min Lin | 2022-02-01 |
| 11114387 | Electronic packaging structure | Jing-Yao Chang, Fang-Jun Leu, Wei Han, Kuo-Shu Kao | 2021-09-07 |
| 11004816 | Hetero-integrated structure | Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Wei-Chung Lo | 2021-05-11 |
| 10784297 | Chip scale package structures | Yu-Min Lin | 2020-09-22 |
| 10743411 | Ceramic substrate component/assembly with raised thermal metal pad, and method for fabricating the component | Ho-Chieh Yu, Chen-Cheng Liao, Chun Lin, Hsiao-Ming Chang, Jing-Yao Chang | 2020-08-11 |
| 10672677 | Semiconductor package structure | Jing-Yao Chang, Kuo-Shu Kao, Fang-Jun Leu, Hsin-Han Lin, Chih-Ming Tzeng +2 more | 2020-06-02 |
| 10622274 | Chip package | Kuo-Shu Kao, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2020-04-14 |
| 10490478 | Chip packaging and composite system board | Yu-Min Lin, Kuo-Shu Kao, Jing-Yao Chang | 2019-11-26 |
| 10490473 | Chip package module and circuit board structure comprising the same | Shin-Yi Huang, Yu-Min Lin | 2019-11-26 |
| 10037980 | Fabricating method of a semiconductor light emitting device | Yu-Wei Huang, Chih-Ming Shen | 2018-07-31 |
| 9721931 | Semiconductor light emitting device and fabricating method thereof | Yu-Wei Huang, Chih-Ming Shen | 2017-08-01 |
| 9706656 | Signal transmission board and method for manufacturing the same | Chien-Min Hsu, Shih-Hsien Wu, Jing-Yao Chang, Ren-Shin Cheng, Min-Lin Lee | 2017-07-11 |
| 9647029 | Light-emitting device and manufacturing method of a display | Wei-Chung Lo, Yu-Wei Huang, Chih-Ming Shen | 2017-05-09 |
| 9308603 | Solder, solder joint structure and method of forming solder joint structure | Kuo-Shu Kao, Wen-Chih Chen | 2016-04-12 |
| 9143243 | Power module for high/low voltage insulation | Shin-Yi Huang, Wen-Chih Chen | 2015-09-22 |
| 9142473 | Stacked type power device module | Yin-Po Hung | 2015-09-22 |
| 9024441 | Bump structure and electronic packaging solder joint structure and fabricating method thereof | Yu-Min Lin, Chau-Jie Zhan | 2015-05-05 |
| 8866309 | Chip package structure | Jing-Yao Chang, Yu-Wei Huang, Yu-Min Lin, Shin-Yi Huang | 2014-10-21 |