Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8742600 | Dual-phase intermetallic interconnection structure and method of fabricating the same | Jing-Yao Chang, Tung-Han Chuang, Chun-Yen Lee | 2014-06-03 |
| 8598686 | Electronic device package structure with a hydrophilic protection layer and method for fabricating the same | Su-Tsai Lu, Jing-Yao Chang, Chau-Jie Zhan | 2013-12-03 |
| 8575754 | Micro-bump structure | Tsung-Fu Tsai, Chau-Jie Zhan | 2013-11-05 |
| 8502378 | Package unit and stacking structure thereof | Yin-Po Hung | 2013-08-06 |
| 8130509 | Package carrier | Tsung-Fu Tsai, Chau-Jie Zhan, Jing-Yao Chang | 2012-03-06 |
| 8093718 | Chip structure and stacked structure of chips | — | 2012-01-10 |
| 5466763 | High performance epoxy resin modified by a polysulfide polymer derived from the heavy ends waste of chlorinated hydrocarbon production | Chester C. Lee, Yung-Hui Huang | 1995-11-14 |
| 5432257 | Process for manufacturing a polysulfide polymer from the heavy ends waste of chlorinated hydrocarbon production | Chester C. Lee, Yung-Hui Huang | 1995-07-11 |