Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10001889 | Mesh electrode, sensing device, and electrode layer | Heng-Tien Lin, Chun-Ting Liu, Shu-Yi Chang, Kuo-Hua Tseng, Sheng-Feng Chung +1 more | 2018-06-19 |
| 9921699 | Conductive line structure and sensing device using the same | Sheng-Feng Chung, Chun-Ting Liu | 2018-03-20 |
| 9811222 | Sensing structure | Bao-Shun Yau, Sheng-Feng Chung, Yu-Ling Hsieh, Cheng-Yi Shih, Shu-Yi Chang +2 more | 2017-11-07 |
| 9606679 | Touch panel and manufacturing method thereof and touch display panel | Jyun-Kai Ciou, Chia-Sheng Huang, Ching-Chih Wei, Heng-Tien Lin | 2017-03-28 |
| 9579878 | Gravure printing system and method of using the same | Sheng-Feng Chung, Cheng-Yi Shih, Shu-Yi Chang, Yu-Jie Wei, Shih-Ming Lin | 2017-02-28 |
| 9448672 | Touch panel structure and fabrication method for the same | Sheng-Feng Chung, Cheng-Yi Shih, Shu-Yi Chang | 2016-09-20 |
| 9395072 | Illumination device | Wen-Yung Yeh, Sheng-Feng Chung, Bao-Shun Yau, Chen-Kun Chen, Yi-Ming Chang | 2016-07-19 |
| 9224790 | Illumination device | Wen-Yung Yeh, Yi-Ming Chang, Chen-Kun Chen | 2015-12-29 |
| 9184153 | Chip stack structure and method for fabricating the same | Jing-Ye Juang | 2015-11-10 |
| 9052789 | Touch structure and manufacturing method for the same | Bao-Shun Yau, Chun-Ting Liu | 2015-06-09 |
| 8604613 | Electronic assembly having a multilayer adhesive structure | Tai-Hong Chen | 2013-12-10 |
| 8598686 | Electronic device package structure with a hydrophilic protection layer and method for fabricating the same | Tao-Chih Chang, Jing-Yao Chang, Chau-Jie Zhan | 2013-12-03 |
| 8415795 | Semiconductor device and assembling method thereof | Yu-Min Lin, Chau-Jie Zhan | 2013-04-09 |
| 8384215 | Wafer level molding structure | Jing-Ye Juang, Yu-Min Lin | 2013-02-26 |
| 8227915 | Bump structure, chip package structure including the same and method of manufacturing the same | Yu-Wei Huang | 2012-07-24 |
| 8134230 | Sealed joint structure of device and process using the same | Tsung-Fu Yang | 2012-03-13 |
| 8134823 | Stacked capacitor structure and manufacturing method thereof | Wen-Hwa Chen, Hsien-Chie Cheng, Yun-Chiao Chen | 2012-03-13 |
| 7999350 | Electrode structure of memory capacitor | Wen-Hwa Chen, Hsien-Chie Cheng, Yun-Chiao Chen | 2011-08-16 |
| 7988808 | Bonding structure with buffer layer and method of forming the same | Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2011-08-02 |
| 7960830 | Electronic assembly having a multilayer adhesive structure | — | 2011-06-14 |
| 7465603 | Wafer level package structure of optical-electronic device and method for making the same | Yuan-Chang Huang, Tai-Hung Chen, Yao-Sheng Lin | 2008-12-16 |
| 7459055 | Bonding structure with buffer layer and method of forming the same | Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2008-12-02 |
| 7446421 | Bonding structure with buffer layer and method of forming the same | Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2008-11-04 |
| 7423348 | Chip structure and chip package structure | — | 2008-09-09 |
| 7378746 | Composite bump | Ji-Cheng Lin, Yao-Sheng Lin, Shyh-Ming Chang, Hsien-Chie Cheng, Tai-Hong Chen | 2008-05-27 |