Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7317235 | Wafer level package structure of optical-electronic device and method for making the same | Yuan-Chang Huang, Tai-Hung Chen, Yao-Sheng Lin | 2008-01-08 |
| 7239027 | Bonding structure of device packaging | — | 2007-07-03 |
| 7183494 | Bonding structure with buffer layer and method of forming the same | Shu-Ming Chang, Shyh-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2007-02-27 |