Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8215969 | Contact structure and forming method thereof and connecting structure thereof | Sheng-Shu Yang | 2012-07-10 |
| 8211788 | Method of fabricating bonding structure | Sheng-Shu Yang | 2012-07-03 |
| 7988808 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shu-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2011-08-02 |
| 7977788 | Contact structure having a compliant bump and a testing area | Sheng-Shu Yang, Chao-Chyun An | 2011-07-12 |
| 7871918 | Manufacturing method of contact structure | — | 2011-01-18 |
| 7834453 | Contact structure having a compliant bump and a test pad | — | 2010-11-16 |
| 7732928 | Structure for protecting electronic packaging contacts from stress | Ji-Cheng Lin, Shou-Lung Chen | 2010-06-08 |
| 7576430 | Bonding structure | Sheng-Shu Yang | 2009-08-18 |
| 7531900 | Package structure for electronic device | Ji-Cheng Lin | 2009-05-12 |
| 7459055 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shu-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2008-12-02 |
| 7449716 | Bond quality indication by bump structure on substrate | Ming-Yao Chen, Sheng-Shu Yang, Ngai Tsang | 2008-11-11 |
| 7446421 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shu-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2008-11-04 |
| 7378746 | Composite bump | Ji-Cheng Lin, Yao-Sheng Lin, Su-Tsai Lu, Hsien-Chie Cheng, Tai-Hong Chen | 2008-05-27 |
| 7348271 | Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls | Yuan-Chang Huang, Su-Chia Lu | 2008-03-25 |
| 7300865 | Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive | Yu-Te HSIEH, Wen-Ti Lin | 2007-11-27 |
| 7183494 | Bonding structure with buffer layer and method of forming the same | Su-Tsai Lu, Shu-Ming Chang, Yao-Sheng Lin, Yuan-Chang Huang | 2007-02-27 |
| 7154176 | Conductive bumps with non-conductive juxtaposed sidewalls | Yuan-Chang Huang, Su-Chia Lu | 2006-12-26 |
| 6972490 | Bonding structure with compliant bumps | Yuan-Chang Huang, Wen-Chih Chen, Sheng-Shu Yang | 2005-12-06 |
| 6919642 | Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive and structures formed | Yu-Te HSIEH, Wen-Ti Lin | 2005-07-19 |
| 6767818 | Method for forming electrically conductive bumps and devices formed | Tai-Hong Chen, Yu-Te HSIEH, Chun-Ming Huang, Jui-Ming Ni, Ching-Yun Chang +1 more | 2004-07-27 |
| 6605491 | Method for bonding IC chips to substrates with non-conductive adhesive | Yu-Te HSIEH, Wen-Ti Lin | 2003-08-12 |
| 6537854 | Method for bonding IC chips having multi-layered bumps with corrugated surfaces and devices formed | Jwo-Huei Jou, Chi Yuan Wu | 2003-03-25 |
| 6365500 | Composite bump bonding | Jwo-Huei Jou, Yu-Chi Lee, Dyi-Chung Hu | 2002-04-02 |
| 6249051 | Composite bump flip chip bonding | Chih-Chiang Chu, Yu-Chi Lee | 2001-06-19 |
| 6084301 | Composite bump structures | Yu-Chi Lee, Jwo-Huei Jou | 2000-07-04 |