Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10327700 | Intelligent insole | Mao-Jiun Wang, Chun Zhang, Hsu-Pin Wang | 2019-06-25 |
| 8149065 | Low KVCO phase-locked loop with large frequency drift handling capability | Randy Tsang, David Cousinard | 2012-04-03 |
| 8144201 | Portable computer capable of performing digital photo frame function under main-power-off state | Ching-Sung Yeh | 2012-03-27 |
| 7940129 | Low KVCO phase-locked loop with large frequency drift handling capability | Randy Tsang, David Cousinard | 2011-05-10 |
| 7632694 | Manufacturing method for a TFT electrode for preventing metal layer diffusion | Cheng-Chung Chen, Yu-Chang Sun, Yi-Hsun Huang, Chien-Wei Wu, Shuo-Wei Liang +5 more | 2009-12-15 |
| 7503531 | Height adjusting mechanism | — | 2009-03-17 |
| 7045817 | Structure of TFT electrode for preventing metal layer diffusion and manufacturing method therefor | Cheng-Chung Chen, Yu-Chang Sun, Yi-Hsun Huang, Chien-Wei Wu, Shuo-Wei Liang +5 more | 2006-05-16 |
| 7006178 | One drop fill LCD panel having light-shielding pattern with first and second metal patterns | Po-Hsiu Shih, Hong Yu, Hung-Jen Chu | 2006-02-28 |
| 6936979 | Frequency-modulated dimming control system of discharge lamp | San-Jung Lee, Ching-Ho Chou | 2005-08-30 |
| 6937315 | Liquid crystal panel with isolation wall structure and its producing method | Po-Hsiu Shih | 2005-08-30 |
| 6879369 | Structure of LCD manufactured by one-drop fill technology including a substrate with transparent conductive patterns | Po-Hsiu Shih | 2005-04-12 |
| 6870591 | Liquid crystal display with separating wall | Po-Hsiu Shih | 2005-03-22 |
| 6556268 | Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB | Chin-Chen Yang, Hong-Yu Lin, Fang I. Shieh | 2003-04-29 |
| 6373545 | Repairable TFT-LCD assembly and method for making in which a separation tape positioned between two anisotropic conductive films | Chin-Chen Yang, Fang I. Shieh, Hong-Yu Lin, Chi Yuan Wu, Su-Yu Fun | 2002-04-16 |
| 6365500 | Composite bump bonding | Shyh-Ming Chang, Jwo-Huei Jou, Dyi-Chung Hu | 2002-04-02 |
| 6249051 | Composite bump flip chip bonding | Shyh-Ming Chang, Chih-Chiang Chu | 2001-06-19 |
| 6084301 | Composite bump structures | Shyh-Ming Chang, Jwo-Huei Jou | 2000-07-04 |
| 6024274 | Method for tape automated bonding to composite bumps | Shyh-Ming Chang, Shyuan-Jeng Ho, Jen-Huang Jeng, Pao-Yun Tang, Su-Yu Fang | 2000-02-15 |
| 5861661 | Composite bump tape automated bonded structure | Pao-Yun Tang, Shyh-Ming Chang, Su-Yu Fang | 1999-01-19 |
| 5749997 | Composite bump tape automated bonding method and bonded structure | Pao-Yun Tang, Shyh-Ming Chang, Su-Yu Fang | 1998-05-12 |
| 5707902 | Composite bump structure and methods of fabrication | Shyh-Ming Chang, Jwo-Huei Jou | 1998-01-13 |
| 5578527 | Connection construction and method of manufacturing the same | Shyh-Ming Chang, Pao-Yun Tang | 1996-11-26 |
| 5431328 | Composite bump flip chip bonding | Shyh-Ming Chang, Chih-Chiang Chu | 1995-07-11 |
| 5393697 | Composite bump structure and methods of fabrication | Shyh-Ming Chang, Hsiu-Mei Yu, Li-Hui Yang, Jwo-Huei Jou | 1995-02-28 |