Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6024274 | Method for tape automated bonding to composite bumps | Shyh-Ming Chang, Shyuan-Jeng Ho, Yu-Chi Lee, Pao-Yun Tang, Su-Yu Fang | 2000-02-15 |
| 5877556 | Structure for composite bumps | T. E. Hsieh | 1999-03-02 |
| 5412997 | Nondestructive testing apparatus and method | Dyi-Chung Hu | 1995-05-09 |
| 5127573 | Tape automated bonding apparatus with automatic leveling stage | Shyh-Ming Chang | 1992-07-07 |