Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9372269 | Scintillator panel, radiation image sensor and method of making the same | Shu-Lin Ho | 2016-06-21 |
| 8921856 | TFT-Pin array substrate and assembly structure for flat-panel X-ray detector | Shu-Lin Ho, Kei-Hsiung Yang | 2014-12-30 |
| 8890198 | Conversion structure, image sensor assembly and method for fabricating conversion structure | Shu-Lin Ho, Kei-Hsiung Yang | 2014-11-18 |
| 8841781 | Chip having a driving integrated circuit | Wei Sun | 2014-09-23 |
| 8491986 | Panel module and manufacturing method thereof | Wei Sun | 2013-07-23 |
| 8427622 | Liquid crystal display panel having a touch function | Kei-Hsiung Yang, Po-Yang Chen | 2013-04-23 |
| 8373838 | Display apparatus | — | 2013-02-12 |
| 8063497 | Liquid crystal display | Wei Sun | 2011-11-22 |
| 8027008 | Liquid crystal display panel having a touch function | Kei-Hsiung Yang, Po-Yang Chen | 2011-09-27 |
| 7456475 | Display panel | Po-Yang Chen | 2008-11-25 |
| 6995474 | Electrical conducting structure and liquid crystal display device comprising the same | Shu-Lin Ho | 2006-02-07 |
| 6912699 | Testing design for flip chip connection process | Shao-Wu Hsu, Shu-Ping Yang | 2005-06-28 |
| 6194780 | Tape automated bonding method and bonded structure | — | 2001-02-27 |
| 6024274 | Method for tape automated bonding to composite bumps | Shyh-Ming Chang, Shyuan-Jeng Ho, Yu-Chi Lee, Jen-Huang Jeng, Su-Yu Fang | 2000-02-15 |
| 6008072 | Tape automated bonding method | — | 1999-12-28 |
| 5861661 | Composite bump tape automated bonded structure | Shyh-Ming Chang, Yu-Chi Lee, Su-Yu Fang | 1999-01-19 |
| 5749997 | Composite bump tape automated bonding method and bonded structure | Shyh-Ming Chang, Yu-Chi Lee, Su-Yu Fang | 1998-05-12 |
| 5578527 | Connection construction and method of manufacturing the same | Shyh-Ming Chang, Yu-Chi Lee | 1996-11-26 |
| 5393359 | Method and apparatus for bonding outer leads of a liquid crystal display to metal leads of a bonding tape | San-Wen Chang, Shyuan-Jeng Ho | 1995-02-28 |