Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6024274 | Method for tape automated bonding to composite bumps | Shyh-Ming Chang, Shyuan-Jeng Ho, Yu-Chi Lee, Jen-Huang Jeng, Pao-Yun Tang | 2000-02-15 |
| 5861661 | Composite bump tape automated bonded structure | Pao-Yun Tang, Shyh-Ming Chang, Yu-Chi Lee | 1999-01-19 |
| 5749997 | Composite bump tape automated bonding method and bonded structure | Pao-Yun Tang, Shyh-Ming Chang, Yu-Chi Lee | 1998-05-12 |