Issued Patents All Time
Showing 1–25 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12315788 | Semiconductor substrate and manufacturing method thereof | — | 2025-05-27 |
| 12249567 | Manufacturing method of integrated substrate structure | — | 2025-03-11 |
| 12210053 | Semiconductor device | — | 2025-01-28 |
| 12199027 | Substrate and manufacturing method thereof | — | 2025-01-14 |
| 12198993 | Manufacturing method of circuit carrier with chip mounted thereon | — | 2025-01-14 |
| 12176277 | Package substrate and package structure | — | 2024-12-24 |
| 12148726 | Semiconductor substrate structure, semiconductor structure and manufacturing method thereof | — | 2024-11-19 |
| 12148688 | Semiconductor substrate and manufacturing method thereof | — | 2024-11-19 |
| 12100632 | Glass core substrate and manufacturing method thereof | — | 2024-09-24 |
| 12014934 | Semiconductor substrate structure and manufacturing method thereof | — | 2024-06-18 |
| 12009329 | Manufacturing method of integrated substrate | — | 2024-06-11 |
| 11984403 | Integrated substrate structure, redistribution structure, and manufacturing method thereof | — | 2024-05-14 |
| 11948899 | Semiconductor substrate structure and manufacturing method thereof | — | 2024-04-02 |
| 11876291 | Millimeter-wave antenna module package structure and manufacturing method thereof | — | 2024-01-16 |
| 11862545 | Integrated substrate structure, electronic assembly, and manufacturing method thereof | — | 2024-01-02 |
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Chang-Hong Hsieh | 2023-10-17 |
| 11567122 | Semiconductor device and manufacturing method thereof | — | 2023-01-31 |
| 11404335 | Manufacturing method of carrier for semiconductor chip mounting thereon | — | 2022-08-02 |
| 11309252 | Package substrate and package structure | — | 2022-04-19 |
| 11125781 | Integrated substrate and manufacturing method thereof | — | 2021-09-21 |
| 11049779 | Carrier for chip packaging and manufacturing method thereof | — | 2021-06-29 |
| 11024573 | Substrate structure with high-density wiring and manufacturing method thereof | — | 2021-06-01 |
| 11018082 | Space transformer and manufacturing method thereof | — | 2021-05-25 |
| 10964580 | Wafer reconfiguration during a coating process or an electric plating process | — | 2021-03-30 |
| 10867907 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Chang-Hong Hsieh | 2020-12-15 |