Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Dyi-Chung Hu | 2023-10-17 |
| 10867907 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Dyi-Chung Hu | 2020-12-15 |
| 10068847 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Dyi-Chung Hu | 2018-09-04 |
| 9485874 | Package substrate having photo-sensitive dielectric layer and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Dyi-Chung Hu | 2016-11-01 |