Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Tao-Chih Chang, Yu-Min Lin, Sheng-Tsai Wu | 2023-12-26 |
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2023-10-17 |
| 11355472 | Package structure and method for connecting components | Yu-Min Lin, Tao-Chih Chang | 2022-06-07 |
| 11004816 | Hetero-integrated structure | Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Tao-Chih Chang | 2021-05-11 |
| 10867907 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2020-12-15 |
| 10276908 | Electromagnetic wave transmission board and differential electromagnetic wave transmission board | Yu-Wei Huang, Shih-Hsien Wu | 2019-04-30 |
| 10068847 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2018-09-04 |
| 9931813 | Bonding structure and method of fabricating the same | Kuan-Neng Chen, Cheng-Ta Ko | 2018-04-03 |
| 9647029 | Light-emitting device and manufacturing method of a display | Yu-Wei Huang, Tao-Chih Chang, Chih-Ming Shen | 2017-05-09 |
| 9485874 | Package substrate having photo-sensitive dielectric layer and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2016-11-01 |
| 9252054 | Thinned integrated circuit device and manufacturing process for the same | Sheng-Tsai Wu, Heng-Chieh Chien, John Hon-Shing Lau, Yu-Lin Chao | 2016-02-02 |
| 9111774 | Wafer-to-wafer stack with supporting post | Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Rong-Shen Lee | 2015-08-18 |
| 8915634 | Plane light source and flexible plane light source | Chao-Kai Hsu, Yu-Hua Chen | 2014-12-23 |
| 8810031 | Wafer-to-wafer stack with supporting pedestal | Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Rong-Shen Lee | 2014-08-19 |
| 8679891 | Heterostructure containing IC and LED and method for fabricating the same | Kuan-Neng Chen, Cheng-Ta Ko | 2014-03-25 |
| 8536613 | Heterostructure containing IC and LED and method for fabricating the same | Kuan-Neng Chen, Cheng-Ta Ko | 2013-09-17 |
| 8304666 | Structure of multiple coaxial leads within single via in substrate and manufacturing method thereof | Cheng-Ta Ko, Min-Lin Lee, Shur-Fen Liu, Jinn-Shing King, Shinn-Juh Lai +1 more | 2012-11-06 |
| 8164165 | Wafer-to-wafer stack with supporting pedestal | Chi-Shih Chang, Ra-Min Tain, Shyi-Ching Liau, Rong-Shen Lee | 2012-04-24 |
| 8049330 | Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels | Ra-Min Tain, Li Shen | 2011-11-01 |
| 8039935 | Wafer level chip scale packaging structure and method of fabricating the same | Shu-Ming Chang, Lee-Cheng Shen | 2011-10-18 |
| 7948072 | Wafer-to-wafer stacking | Ra-Min Tain, Shu-Ming Chang, Shyi-Ching Liau, Rong-Shen Lee, Chi-Shih Chang | 2011-05-24 |
| 7329563 | Method for fabrication of wafer level package incorporating dual compliant layers | Hsin-Chien Huang, Ming Lu | 2008-02-12 |
| 6914333 | Wafer level package incorporating dual compliant layers and method for fabrication | Hsin-Chien Huang, Ming Lu | 2005-07-05 |