Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869850 | Package structure comprising conductive metal board and ground element | CHAO-HSUAN WANG, Po-Sheng Huang | 2024-01-09 |
| 11410901 | Package structure and manufacturing method thereof | Ying-Po Hung, CHAO-CHIEH CHAN, CHAO-HSUAN WANG | 2022-08-09 |
| 8692721 | Wireless communicating device and portable electronic apparatus using the same | Tsung-Ying Hsieh, Chin-Lien Hsu | 2014-04-08 |
| 8228083 | Testing system and testing method | — | 2012-07-24 |
| 8039935 | Wafer level chip scale packaging structure and method of fabricating the same | Shu-Ming Chang, Wei-Chung Lo | 2011-10-18 |
| 7436683 | Wafer level packaging structure with inductors and manufacture method thereof | — | 2008-10-14 |
| 7319050 | Wafer level chip scale packaging structure and method of fabricating the same | Shu-Ming Chang | 2008-01-15 |
| 6998718 | Wafer level chip scale packaging structure and method of fabricating the same | Shu-Ming Chang | 2006-02-14 |