Issued Patents All Time
Showing 25 most recent of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376226 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Benito Joseph Rodriguez, Dillip K. Dash, Po-Chun Yang, Juan-Yi Wu | 2025-07-29 |
| 12341109 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2025-06-24 |
| 12272712 | Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region | Tsang-Yu Liu, Chaung-Lin LAI | 2025-04-08 |
| 12248353 | Method of performing power saving control on display device and related display device | Hung-Yu Huang, Chia-Hui Wang, Shiang-Wei Wang, Sheng-Wen Huang, Tsung-Yi Tsai | 2025-03-11 |
| 12237354 | Chip package and method for forming the same | Tsang-Yu Liu, Chaung-Lin LAI | 2025-02-25 |
| 11784134 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2023-10-10 |
| 11746003 | Chip package | Tsang-Yu Liu, Chaung-Lin LAI | 2023-09-05 |
| 11749618 | Chip package including substrate having through hole and redistribution line | Chia-Ming Cheng | 2023-09-05 |
| 11521938 | Chip package including substrate inclined sidewall and redistribution line | Chia-Ming Cheng | 2022-12-06 |
| 11319208 | Chip package and manufacturing method thereof | Tsang-Yu Liu, Chaung-Lin LAI | 2022-05-03 |
| 11312995 | Method for detecting SNP site on SMA gene | Hung-Ming Chang, Chien-Hsing Lin | 2022-04-26 |
| 11212912 | Printed circuit board mesh routing to reduce solder ball joint failure during reflow | Benito Joseph Rodriguez, Dillip K. Dash, Po-Chun Yang, Juan-Yi Wu | 2021-12-28 |
| 11164853 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2021-11-02 |
| 10950738 | Chip package and method for forming the same | Tsang-Yu Liu | 2021-03-16 |
| 10446504 | Chip package and method for forming the same | Chia-Ming Cheng, Po-Han Lee, Wei-Chung Yang, Kuan-Jung Wu | 2019-10-15 |
| 10318784 | Touch panel-sensing chip package module complex and a manufacturing method thereof | Tsang-Yu Liu, Yen-Shih Ho | 2019-06-11 |
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Yu-Lung Huang, Tsang-Yu Liu, Yen-Shih Ho | 2018-12-11 |
| 10049252 | Chip package and fabrication method thereof | Yen-Shih Ho, Tsang-Yu Liu, Hsing-Lung SHEN | 2018-08-14 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +4 more | 2018-04-17 |
| 9881889 | Chip package and method for fabricating the same | Yu-Lung Huang, Tsang-Yu Liu, Yen-Shih Ho | 2018-01-30 |
| 9793234 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsing-Lung SHEN | 2017-10-17 |
| 9711425 | Sensing module and method for forming the same | Po-Chang Huang, Tsang-Yu Liu, Yu-Lung Huang, Chi-Chang Liao | 2017-07-18 |
| 9640488 | Chip package and method for forming the same | Yi-Min Lin, Yi-Ming Chang, Yen-Shih Ho, Tsang-Yu Liu, Chia-Ming Cheng | 2017-05-02 |
| 9601460 | Chip package including recess in side edge | Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng, Tzu-Wen Tseng | 2017-03-21 |
| 9570398 | Chip package and method for forming the same | Yu-Ting Huang, Tsang-Yu Liu, Yen-Shih Ho | 2017-02-14 |