Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400931 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2025-08-26 |
| 12278189 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2025-04-15 |
| 12205906 | Electronic package and fabrication method thereof | Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen | 2025-01-21 |
| 12100642 | Electronic package and fabrication method thereof | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2024-09-24 |
| 12080618 | Electronic package, heat dissipation structure and manufacturing method thereof | Kuo-Hua Yu, Chang-Fu Lin | 2024-09-03 |
| 11984379 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2024-05-14 |
| 11881459 | Electronic package and fabrication method thereof | Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen | 2024-01-23 |
| 11810862 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2023-11-07 |
| 11792938 | Method for fabricating carrier structure | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2023-10-17 |
| 11605554 | Flip-chip process and bonding equipment | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2023-03-14 |
| 11521930 | Electronic package and manufacturing method thereof | Chih-Ming Huang, Kuo-Hua Yu, Chang-Fu Lin | 2022-12-06 |
| 11482470 | Electronic package and fabrication method thereof | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2022-10-25 |
| 11410954 | Electronic package, manufacturing method thereof and conductive structure | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2022-08-09 |
| 11069661 | Electronic package | Wei-Jhen Chen, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2021-07-20 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin +2 more | 2021-03-16 |
| 10863626 | Electronic package carrier structure thereof, and method for fabricating the carrier structure | Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu | 2020-12-08 |
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2018-12-11 |
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Tsang-Yu Liu, Ying-Nan Wen, Chi-Chang Liao | 2018-11-27 |
| 10109663 | Chip package and method for forming the same | Tsang-Yu Liu, Yi-Ming Chang, Hsin Kuan | 2018-10-23 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +4 more | 2018-04-17 |
| 9881889 | Chip package and method for fabricating the same | Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2018-01-30 |
| 9865526 | Chip package and method for forming the same | — | 2018-01-09 |
| 9711425 | Sensing module and method for forming the same | Shu-Ming Chang, Po-Chang Huang, Tsang-Yu Liu, Chi-Chang Liao | 2017-07-18 |
| 9620431 | Chip package including recess in side edge | Chia-Ming Cheng, Tsang-Yu Liu, Chi-Chang Liao | 2017-04-11 |
| 9437478 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Chao-Yen Lin, Wei-Luen SUEN +2 more | 2016-09-06 |