Issued Patents All Time
Showing 1–25 of 105 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272712 | Chip package and method for forming a chip package having first and second stack of dummy metal layers surround the sensing region | Chaung-Lin LAI, Shu-Ming Chang | 2025-04-08 |
| 12237354 | Chip package and method for forming the same | Shu-Ming Chang, Chaung-Lin LAI | 2025-02-25 |
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Kuei-Wei Chen | 2024-03-26 |
| 11873212 | Chip package and manufacturing method thereof | Wei-Luen SUEN, Jiun-Yen LAI, Hsing-Lung SHEN | 2024-01-16 |
| 11746003 | Chip package | Chaung-Lin LAI, Shu-Ming Chang | 2023-09-05 |
| 11705368 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Kuei-Wei Chen | 2023-07-18 |
| 11476293 | Manufacturing method of chip package | Yen-Shih Ho, Po-Han Lee | 2022-10-18 |
| 11319208 | Chip package and manufacturing method thereof | Chaung-Lin LAI, Shu-Ming Chang | 2022-05-03 |
| 11310904 | Chip package and power module | Po-Han Lee, Wei-Ming CHIEN | 2022-04-19 |
| 11137559 | Optical chip package and method for forming the same | Jiun-Yen LAI, Yu-Ting Huang, Hsing-Lung SHEN, Hui-Hsien Wu | 2021-10-05 |
| 11121031 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Kuei-Wei Chen | 2021-09-14 |
| 11107759 | Chip package and manufacturing method thereof | Wei-Luen SUEN, Jiun-Yen LAI, Hsing-Lung SHEN | 2021-08-31 |
| 10950738 | Chip package and method for forming the same | Shu-Ming Chang | 2021-03-16 |
| 10833118 | Chip package and manufacturing method thereof | Chia-Ming Cheng | 2020-11-10 |
| 10461117 | Semiconductor structure and method for manufacturing semiconductor structure | Yen-Shih Ho, Chia-Sheng Lin, Chaung-Lin LAI | 2019-10-29 |
| 10318784 | Touch panel-sensing chip package module complex and a manufacturing method thereof | Shu-Ming Chang, Yen-Shih Ho | 2019-06-11 |
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Shu-Ming Chang, Yu-Lung Huang, Yen-Shih Ho | 2018-12-11 |
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Ying-Nan Wen, Chi-Chang Liao, Yu-Lung Huang | 2018-11-27 |
| 10109559 | Electronic device package and fabrication method thereof | Chia-Sheng Lin, Yen-Shih Ho | 2018-10-23 |
| 10109663 | Chip package and method for forming the same | Yu-Lung Huang, Yi-Ming Chang, Hsin Kuan | 2018-10-23 |
| 10096635 | Semiconductor structure and manufacturing method thereof | Wei-Ming CHIEN, Po-Han Lee, Yen-Shih Ho | 2018-10-09 |
| 10050006 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Yen-Shih Ho | 2018-08-14 |
| 10049252 | Chip package and fabrication method thereof | Yen-Shih Ho, Shu-Ming Chang, Hsing-Lung SHEN | 2018-08-14 |
| 9997473 | Chip package and method for forming the same | Yen-Shih Ho, Chia-Sheng Lin, Chaung-Lin LAI | 2018-06-12 |
| 9978788 | Photosensitive module and method for forming the same | Yen-Shih Ho, Chi-Chang Liao | 2018-05-22 |