Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen | 2024-03-26 |
| 11705368 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen | 2023-07-18 |
| 11137559 | Optical chip package and method for forming the same | Jiun-Yen LAI, Yu-Ting Huang, Hsing-Lung SHEN, Tsang-Yu Liu | 2021-10-05 |
| 11121031 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Jian-Hong Chen, Tsang-Yu Liu, Kuei-Wei Chen | 2021-09-14 |
| 9947716 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +4 more | 2018-04-17 |
| 9875912 | Chip package and manufacturing method thereof | Yen-Shih Ho, Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee +1 more | 2018-01-23 |
| D679311 | Micro projector | Wei-Hong Chen, Heng Liu | 2013-04-02 |
| 6697260 | High-speed package design with suspended substrates and PCB | Yu-Ju Chen, Thomas J. Sleboda, Michael Z. Wong | 2004-02-24 |
| 6548893 | Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages | Yu-Ju Chen | 2003-04-15 |