Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973095 | Method for forming chip package with second opening surrounding first opening having conductive structure therein | Chia-Ming Cheng, Chia-Sheng Lin | 2024-04-30 |
| 11942563 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu | 2024-03-26 |
| 11705368 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu | 2023-07-18 |
| 11450697 | Chip package with substrate having first opening surrounded by second opening and method for forming the same | Chia-Ming Cheng, Chia-Sheng Lin | 2022-09-20 |
| 11121031 | Manufacturing method of chip package and chip package | Chia-Sheng Lin, Hui-Hsien Wu, Jian-Hong Chen, Tsang-Yu Liu | 2021-09-14 |
| 11056427 | Chip package | Chia-Ming Cheng | 2021-07-06 |
| 9318461 | Wafer level array of chips and method thereof | Chun-Wei Chang, Chia-Ming Cheng, Chia-Sheng Lin, Chien-Hui Chen, Tsang-Yu Liu | 2016-04-19 |