Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374572 | Systems and methods for systematic physical failure analysis (PFA) fault localization | Peng Chen, Wen-Hao Cheng, Jyun-Hong Chen | 2025-07-29 |
| 12027396 | Systems and methods for systematic physical failure analysis (PFA) fault localization | Peng Chen, Wen-Hao Cheng, Jyun-Hong Chen | 2024-07-02 |
| 11600505 | Systems and methods for systematic physical failure analysis (PFA) fault localization | Peng Chen, Wen-Hao Cheng, Jyun-Hong Chen | 2023-03-07 |
| 11601015 | Wireless charger | Tsung-Chan Wu, Kuan Yu Chiu, Yen-Ming Liu | 2023-03-07 |
| 10388541 | Wafer coating system and method of manufacturing chip package | Yu-Tung Chen, Quan Su, Chuan-Jin Shiu, Hsiao-Lan Yeh, Yen-Shih Ho | 2019-08-20 |
| 9711403 | Method for forming chip package | Ming-Kun Yang, Tsang-Yu Liu, Yen-Shih Ho | 2017-07-18 |
| 9478469 | Integrated circuit comprising buffer chain | Yi-Lin Chuang, Wei-Pin Changchien, Chin-Her Chien, Nan-Hsin Tseng | 2016-10-25 |
| 9437478 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +2 more | 2016-09-06 |
| 9425134 | Chip package | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +1 more | 2016-08-23 |
| 9355975 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +2 more | 2016-05-31 |
| 9355970 | Chip package and method for forming the same | Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN | 2016-05-31 |
| 9349710 | Chip package and method for forming the same | Tsang-Yu Liu, Chun-Wei Chang, Chia-Ming Cheng | 2016-05-24 |
| 9318461 | Wafer level array of chips and method thereof | Chun-Wei Chang, Kuei-Wei Chen, Chia-Ming Cheng, Chia-Sheng Lin, Tsang-Yu Liu | 2016-04-19 |
| 9305843 | Chip package and method for forming the same | Bing-Siang Chen, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2016-04-05 |
| 9275963 | Semiconductor structure having stage difference surface and manufacturing method thereof | Yung-Tai Tsai, Shu-Ming Chang, Chun-Wei Chang, Tsang-Yu Liu, Yen-Shih Ho | 2016-03-01 |
| 9209124 | Chip package | Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN | 2015-12-08 |
| 9184092 | Chip package and method for forming the same | Yu-Lin Yen, Tsang-Yu Liu, Long-Sheng Yeou | 2015-11-10 |
| 9165890 | Chip package comprising alignment mark and method for forming the same | Yen-Shih Ho, Shih-Chin Chen, Yi-Ming Chang, Chia-Ming Cheng, Wei-Luen SUEN +1 more | 2015-10-20 |
| 9024437 | Chip package and method for forming the same | Yu-Lin Yen, Tsang-Yu Liu, Yen-Shih Ho | 2015-05-05 |
| 8981842 | Integrated circuit comprising buffer chain | Yi-Lin Chuang, Wei-Pin Changchien, Chin-Her Chien, Nan-Hsin Tseng | 2015-03-17 |
| 8963312 | Stacked chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin +1 more | 2015-02-24 |
| 8952501 | Chip package and method for forming the same | Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN | 2015-02-10 |
| 8951836 | Chip package and method for forming the same | Yu-Lin Yen, Tsang-Yu Liu, Long-Sheng Yeou | 2015-02-10 |
| 8878367 | Substrate structure with through vias | Chia-Sheng Lin, Bing-Siang Chen, Tzu-Hsiang Hung | 2014-11-04 |
| 8836134 | Semiconductor stacked package and method of fabricating the same | Po-Shen Lin, Chuan-Jin Shiu, Bing-Siang Chen, Chen-Han Chiang, Hsi-Chien Lin +1 more | 2014-09-16 |