| 9165890 |
Chip package comprising alignment mark and method for forming the same |
Yen-Shih Ho, Shih-Chin Chen, Yi-Ming Chang, Chien-Hui Chen, Chia-Ming Cheng +1 more |
2015-10-20 |
| 9054114 |
Chip package structure and manufacturing method thereof |
Hung-Jen Lee, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho |
2015-06-09 |
| 8836134 |
Semiconductor stacked package and method of fabricating the same |
Po-Shen Lin, Chuan-Jin Shiu, Bing-Siang Chen, Chien-Hui Chen, Hsi-Chien Lin +1 more |
2014-09-16 |
| 8779558 |
Chip package structure and manufacturing method thereof |
Hung-Jen Lee, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho |
2014-07-15 |
| 8673686 |
Chip package structure and manufacturing method thereof |
Hung-Jen Lee, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho |
2014-03-18 |
| 8409925 |
Chip package structure and manufacturing method thereof |
Hung-Jen Lee, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho |
2013-04-02 |