Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388541 | Wafer coating system and method of manufacturing chip package | Yu-Tung Chen, Quan Su, Chien-Hui Chen, Hsiao-Lan Yeh, Yen-Shih Ho | 2019-08-20 |
| 9613904 | Semiconductor structure and manufacturing method thereof | Yu-Tung Chen, Chien-Min Lin, Chih-Wei Ho, Yen-Shih Ho | 2017-04-04 |
| 9230927 | Method of fabricating wafer-level chip package | Tsang-Yu Liu, Chih-Wei Ho, Shih-Hsing Chan, Ching-Jui Chuang | 2016-01-05 |
| 8900913 | Chip package and method for forming the same | Po-Shen Lin, Shen-Yuan Mao, Cheng-Chi Peng | 2014-12-02 |
| 8890191 | Chip package and method for forming the same | Po-Shen Lin, Yi-Ming Chang | 2014-11-18 |
| 8836134 | Semiconductor stacked package and method of fabricating the same | Po-Shen Lin, Bing-Siang Chen, Chen-Han Chiang, Chien-Hui Chen, Hsi-Chien Lin +1 more | 2014-09-16 |
| 8785956 | Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same | Po-Shen Lin, Yi-Ming Chang, Hui-Ching Yang, Chiung-Lin Lai | 2014-07-22 |
| 8779452 | Chip package | Tzu-Hsiang Hung, Hsin-Chih Chiu, Chia-Sheng Lin, Yen-Shih Ho, Yu-Min Liang | 2014-07-15 |
| 8633558 | Package structure for a chip and method for fabricating the same | Ta-Hsuan Lin, Chia-Ming Cheng, Tsang-Yu Liu | 2014-01-21 |
| 8604578 | Chip package | Hsin-Chih Chiu, Chia-Ming Cheng, Bai-Yao Lou | 2013-12-10 |
| 8575634 | Chip package and method for fabricating the same | Tsang-Yu Liu, Yu-Lin Yen, Po-Shen Lin | 2013-11-05 |
| 8536671 | Chip package | Tsang-Yu Liu, Yu-Lin Yen, Po-Shen Lin | 2013-09-17 |
| 8431946 | Chip package and method for forming the same | Hsin-Chih Chiu, Chia-Ming Cheng, Bai-Yao Lou | 2013-04-30 |
| 8384174 | Chip package | Hsin-Chih Chiu, Chia-Ming Cheng, Bai-Yao Lou | 2013-02-26 |