Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400883 | Structure of transferring dies for use in mass transferring process | Yung-Hsiang Chen, Yun Wei, Ke-Fang Hsu, Ching-Yi Hsu | 2025-08-26 |
| 11476293 | Manufacturing method of chip package | Tsang-Yu Liu, Po-Han Lee | 2022-10-18 |
| 11038077 | Chip package and manufacturing method thereof | Po-Han Lee, Chien-Min Lin, Yi-Rong Ho | 2021-06-15 |
| 10461117 | Semiconductor structure and method for manufacturing semiconductor structure | Tsang-Yu Liu, Chia-Sheng Lin, Chaung-Lin LAI | 2019-10-29 |
| 10424540 | Chip package and method for forming the same | Po-Han Lee, Chia-Ming Cheng, Hsin-Yen Lin | 2019-09-24 |
| 10388541 | Wafer coating system and method of manufacturing chip package | Yu-Tung Chen, Quan Su, Chuan-Jin Shiu, Chien-Hui Chen, Hsiao-Lan Yeh | 2019-08-20 |
| 10318784 | Touch panel-sensing chip package module complex and a manufacturing method thereof | Shu-Ming Chang, Tsang-Yu Liu | 2019-06-11 |
| 10152180 | Chip scale sensing chip package and a manufacturing method thereof | Shu-Ming Chang, Yu-Lung Huang, Tsang-Yu Liu | 2018-12-11 |
| 10153237 | Chip package and method for forming the same | Chia-Sheng Lin, Po-Han Lee, Wei-Luen SUEN | 2018-12-11 |
| 10109559 | Electronic device package and fabrication method thereof | Chia-Sheng Lin, Tsang-Yu Liu | 2018-10-23 |
| 10096635 | Semiconductor structure and manufacturing method thereof | Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2018-10-09 |
| 10050006 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Tsang-Yu Liu | 2018-08-14 |
| 10049252 | Chip package and fabrication method thereof | Shu-Ming Chang, Tsang-Yu Liu, Hsing-Lung SHEN | 2018-08-14 |
| 9997473 | Chip package and method for forming the same | Tsang-Yu Liu, Chia-Sheng Lin, Chaung-Lin LAI | 2018-06-12 |
| 9978788 | Photosensitive module and method for forming the same | Tsang-Yu Liu, Chi-Chang Liao | 2018-05-22 |
| 9947716 | Chip package and manufacturing method thereof | Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee, Hui-Hsien Wu +4 more | 2018-04-17 |
| 9887229 | Sensing chip package and a manufacturing method thereof | Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng | 2018-02-06 |
| 9881889 | Chip package and method for fabricating the same | Yu-Lung Huang, Shu-Ming Chang, Tsang-Yu Liu | 2018-01-30 |
| 9875912 | Chip package and manufacturing method thereof | Hsiao-Lan Yeh, Chia-Sheng Lin, Yi-Ming Chang, Po-Han Lee, Hui-Hsien Wu +1 more | 2018-01-23 |
| 9793234 | Chip package and manufacturing method thereof | Shu-Ming Chang, Hsing-Lung SHEN | 2017-10-17 |
| 9780251 | Semiconductor structure and manufacturing method thereof | Wei-Luen SUEN, Wei-Ming CHIEN, Po-Han Lee, Tsang-Yu Liu | 2017-10-03 |
| 9761555 | Passive component structure and manufacturing method thereof | Jiun-Yen LAI, Yu-Wen Hu, Bai-Yao Lou, Chia-Sheng Lin, Hsin Kuan | 2017-09-12 |
| 9711403 | Method for forming chip package | Chien-Hui Chen, Ming-Kun Yang, Tsang-Yu Liu | 2017-07-18 |
| 9685354 | Separation apparatus and a method for separating a cap layer from a chip package by means of the separation apparatus | Tsang-Yu Liu, Chia-Sheng Lin, Yi-Ming Chang | 2017-06-20 |
| 9653422 | Chip package and method for forming the same | Chia-Lun SHEN, Yi-Ming Chang, Tsang-Yu Liu | 2017-05-16 |