Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9177862 | Semiconductor stack structure and fabrication method thereof | Hsin Kuan, Long-Sheng Yeou, Tsang-Yu Liu, Chia-Ming Cheng | 2015-11-03 |
| 9165890 | Chip package comprising alignment mark and method for forming the same | Shih-Chin Chen, Yi-Ming Chang, Chien-Hui Chen, Chia-Ming Cheng, Wei-Luen SUEN +1 more | 2015-10-20 |
| 9153528 | Chip package and method for forming the same | Po-Shen Lin, Tsang-Yu Liu, Chih-Wei Ho, Yu-Min Liang | 2015-10-06 |
| 9153707 | Chip package and method for forming the same | Ying-Nan Wen, Tsang-Yu Liu | 2015-10-06 |
| 9136241 | Chip package and manufacturing method thereof | Yu-Lin Yen, Kuo-Hua Liu, Yu-Lung Huang, Tsang-Yu Liu | 2015-09-15 |
| 9054114 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Tsang-Yu Liu | 2015-06-09 |
| 9024437 | Chip package and method for forming the same | Yu-Lin Yen, Chien-Hui Chen, Tsang-Yu Liu | 2015-05-05 |
| 8981497 | Chip package structure and method for forming the same | Ho-Yin Yiu, Chien-Hung Liu, Tsang-Yu Liu, Ying-Nan Wen | 2015-03-17 |
| 8975755 | Chip package | Tsang-Yu Liu, Chia-Sheng Lin | 2015-03-10 |
| 8963312 | Stacked chip package and method for forming the same | Tsang-Yu Liu, Shu-Ming Chang, Yu-Lung Huang, Chao-Yen Lin, Wei-Luen SUEN +1 more | 2015-02-24 |
| 8928098 | Semiconductor package and fabrication method thereof | Hung-Jen Lee, Shu-Ming Chang, Tsang-Yu Liu | 2015-01-06 |
| 8900924 | Chip package and method for forming the same | Shu-Ming Chang, Tsang-Yu Liu | 2014-12-02 |
| 8836134 | Semiconductor stacked package and method of fabricating the same | Po-Shen Lin, Chuan-Jin Shiu, Bing-Siang Chen, Chen-Han Chiang, Chien-Hui Chen +1 more | 2014-09-16 |
| 8779452 | Chip package | Tzu-Hsiang Hung, Hsin-Chih Chiu, Chuan-Jin Shiu, Chia-Sheng Lin, Yu-Min Liang | 2014-07-15 |
| 8779558 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Tsang-Yu Liu | 2014-07-15 |
| 8692300 | Interposer and method for forming the same | Ming-Kun Yang, Tsang-Yu Liu | 2014-04-08 |
| 8692358 | Image sensor chip package and method for forming the same | Yu-Lung Huang, Tzu-Hsiang Hung | 2014-04-08 |
| 8673686 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Tsang-Yu Liu | 2014-03-18 |
| 8674518 | Chip package and method for forming the same | Shu-Ming Chang, Tsang-Yu Liu | 2014-03-18 |
| 8643070 | Chip package and method for forming the same | Shu-Ming Chang, Chien-Hui Chen, Chien-Hung Liu, Ho-Yin Yiu, Ying-Nan Wen | 2014-02-04 |
| 8624362 | IC wafer having electromagnetic shielding effects and method for making the same | Yao-Hsiang Chen, Tsang-Yu Liu, Shu-Ming Chang | 2014-01-07 |
| 8614488 | Chip package and method for forming the same | Ying-Nan Wen, Ho-Yin Yiu, Shu-Ming Chang, Chien-Hung Liu, Shih-Yi LEE +1 more | 2013-12-24 |
| 8409925 | Chip package structure and manufacturing method thereof | Hung-Jen Lee, Shu-Ming Chang, Chen-Han Chiang, Tsang-Yu Liu | 2013-04-02 |
| 7592891 | Planar spiral inductor structure having enhanced Q value | Hun-Ming Hsu | 2009-09-22 |
| 7370403 | Method of fabricating a planar spiral inductor structure having an enhanced Q value | Hun-Ming Hsu | 2008-05-13 |