Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1011958 | Magnetic holding strap | — | 2024-01-23 |
| 10157875 | Chip package and method for forming the same | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-12-18 |
| 10140498 | Wafer-level packaging sensing device and method for forming the same | Tsang-Yu Liu, Chi-Chang Liao, Yu-Lung Huang | 2018-11-27 |
| 10056419 | Chip package having chip connected to sensing device with redistribution layer in insulator layer | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-08-21 |
| 9966358 | Chip package | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-05-08 |
| 9935148 | Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer | Ho-Yin Yiu, Chien-Hung Liu, Wei-Chung Yang | 2018-04-03 |
| 9831185 | Chip package and fabrication method thereof | Shih-Yi LEE, Chien-Hung Liu, Ho-Yin Yiu | 2017-11-28 |
| 9812413 | Chip module and method for forming the same | Ho-Yin Yiu, Chien-Hung Liu | 2017-11-07 |
| 9780050 | Method of fabricating chip package with laser | Chien-Hung Liu, Shih-Yi LEE, Ho-Yin Yiu | 2017-10-03 |
| 9768067 | Chip package and manufacturing method thereof | Chien-Hung Liu, Shih-Yi LEE, Ho-Yin Yiu | 2017-09-19 |
| 9721911 | Chip package and manufacturing method thereof | Ho-Yin Yiu, Chien-Hung Liu, Shih-Yi LEE | 2017-08-01 |
| 9640405 | Chip package having a laser stop structure | Chien-Hung Liu, Shih-Yi LEE, Ho-Yin Yiu | 2017-05-02 |
| 9543233 | Chip package having a dual through hole redistribution layer structure | Chien-Hung Liu, Shih-Yi LEE, Ho-Yin Yiu | 2017-01-10 |
| 9406578 | Chip package having extended depression for electrical connection and method of manufacturing the same | Chien-Hung Liu, Ho-Yin Yiu | 2016-08-02 |
| 9379072 | Chip package and method for forming the same | Chien-Hung Liu | 2016-06-28 |
| 9281243 | Chip scale package structure and manufacturing method thereof | Chien-Hung Liu | 2016-03-08 |
| 9236320 | Chip package | Yi-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2016-01-12 |
| 9177919 | Chip package and method for forming the same | Chien-Hung Liu | 2015-11-03 |
| 9153707 | Chip package and method for forming the same | Yen-Shih Ho, Tsang-Yu Liu | 2015-10-06 |
| 9093450 | Chip package and manufacturing method thereof | Baw-Ching Perng, Shu-Ming Chang | 2015-07-28 |
| 8981497 | Chip package structure and method for forming the same | Ho-Yin Yiu, Chien-Hung Liu, Tsang-Yu Liu, Yen-Shih Ho | 2015-03-17 |
| 8823179 | Electronic device package and method for fabricating the same | Chia-Lun Tsai, Wen-Cheng Chien, Po-Han Lee, Wei-Ming Chen, Chien-Hung Liu | 2014-09-02 |
| 8791768 | Capacitive coupler packaging structure | Ho-Yin Yiu, Chien-Hung Liu, Shih-Yi LEE, Wei-Chung Yang, Bai-Yao Lou +1 more | 2014-07-29 |
| 8778798 | Electronic device package and fabrication method thereof | Shu-Ming Chang, Bai-Yao Lou, Chien-Hung Liu | 2014-07-15 |
| 8766431 | Power MOSFET package | Baw-Ching Perng, Shu-Ming Chang, Ching-Yu Ni, Yun-Ji Hsieh, Wei-Ming Chen +2 more | 2014-07-01 |