Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11635087 | Airflow-doubling vane structure | — | 2023-04-25 |
| 9190362 | Image sensor package with trench insulator and fabrication method thereof | Wen-Ken Huang, Chien-Hung Liu, Joey Lai | 2015-11-17 |
| 8866268 | Semiconductor package structure and manufacturing method thereof | Shang-Yi Wu, Chia-Lun Tsai, Tien-Hao Huang | 2014-10-21 |
| 8823179 | Electronic device package and method for fabricating the same | Chia-Lun Tsai, Po-Han Lee, Wei-Ming Chen, Chien-Hung Liu, Ying-Nan Wen | 2014-09-02 |
| 8772919 | Image sensor package with trench insulator and fabrication method thereof | Wen-Ken Huang, Chien-Hung Liu, Joey Lai | 2014-07-08 |
| 8723214 | Submount and manufacturing method thereof | Chia-Lun Tsai | 2014-05-13 |
| 8643198 | Electronic device package and method for forming the same | Ching-Yu Ni, Shu-Ming Chang | 2014-02-04 |
| 8552547 | Electronic device package and method for forming the same | Ching-Yu Ni, Shu-Ming Chang | 2013-10-08 |
| 8541877 | Electronic device package and method for fabricating the same | Chia-Lun Tsai, Ching-Yu Ni, Tien-Hao Huang, Chia-Ming Cheng, Nan-Chun Lin +3 more | 2013-09-24 |
| 8431950 | Light emitting device package structure and fabricating method thereof | Chia-Lun Tsai, Ching-Yu Ni, Shang-Yi Wu, Cheng-Te Chou | 2013-04-30 |
| 8384222 | Semiconductor device and manufacturing method thereof | Chia-Lun Tsai, Ching-Yu Ni, Jack Chen | 2013-02-26 |
| 8367477 | Electronic device package and method for forming the same | Ching-Yu Ni, Shu-Ming Chang | 2013-02-05 |
| 8319347 | Electronic device package and fabrication method thereof | Chia-Lun Tsai, Po-Han Lee, Wei-Ming Chen | 2012-11-27 |
| 8232202 | Image sensor package and fabrication method thereof | Wang-Ken Huang | 2012-07-31 |
| 7968448 | Semiconductor device and manufacturing method thereof | Chia-Lun Tsai, Ching-Yu Ni, Jack Chen | 2011-06-28 |
| 7029596 | Computer integrated manufacturing control system for oxide chemical mechanical polishing | Heng Hsieh | 2006-04-18 |
| 6624465 | Multi-layer spacer technology for flash EEPROM | Hui-Chen Chu | 2003-09-23 |
| 6338668 | In-line chemical mechanical polish (CMP) planarizing method employing interpolation and extrapolation | Chih-Lung Lin | 2002-01-15 |
| 6319839 | Approach to form an inter-polysilicon oxide (IPO) layer for charge coupled devices | Jen-Pan Wang | 2001-11-20 |
| 6303510 | Plasma etch method with attenuated patterned layer charging | Hui-Chen Chu | 2001-10-16 |
| 6297160 | Application of pure aluminum to prevent pad corrosion | — | 2001-10-02 |
| 6274397 | Method to preserve the testing chip for package's quality | Ho-Yin Yiu, Hui-Chen Chu | 2001-08-14 |
| 6248661 | Method for monitoring bubble formation and abnormal via defects in a spin-on-glass planarization, etchback process | Chen-Peng Fan | 2001-06-19 |
| 6110843 | Etch back method for smoothing microbubble-generated defects in spin-on-glass interlayer dielectric | Chen-Peng Fan | 2000-08-29 |
| 6071826 | Method of manufacturing CMOS image sensor leakage free with double layer spacer | Ching-Wen Cho, Hua Yang, Sen-Fu Chen, Chih-Heng Shen, Chang-Jen Wu +2 more | 2000-06-06 |