SC

Sen-Fu Chen

TSMC: 19 patents #1,728 of 12,232Top 15%
Overall (All Time): #242,084 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
6682659 Method for forming corrosion inhibited conductor layer Ching-Wen Cho, Kuwi-Jen Chang, Kuang-Peng Lin, Shing-Jzy Tay, Szu-Hung Yang +6 more 2004-01-27
6627971 Polysilicon structures with different resistance values for gate electrodes, resistors, and capacitor plates Chih-Heng Shen, Huan-Wen Wang, Ying-Tzu Yen 2003-09-30
6624466 Implant method for forming Si3N4 spacer Ching-Wen Cho, Huan-Wen Wang, Chih-Heng Shen 2003-09-23
6394104 Method of controlling and improving SOG etchback etcher Ming-Chieh Yeh 2002-05-28
6380030 Implant method for forming Si3N4 spacer Ching-Wen Cho, Huan-Wen Wang, Chih-Heng Shen 2002-04-30
6320269 Method for preparing a semiconductor wafer to receive a protective tape Kuei-Jen Chang 2001-11-20
6232172 Method to prevent auto-doping induced threshold voltage shift Yuan-Ko Hwang, Huan-Wen Wang 2001-05-15
6211031 Method to produce dual polysilicon resistance in an integrated circuit Dah-Chih Lin, Chin-Heng Shen 2001-04-03
6162584 Method of fabricating polysilicon structures with different resistance values for gate electrodes, resistors and capacitor plates in an integrated circuit Chih-Heng Shen 2000-12-19
6143474 Method of fabricating polysilicon structures with different resistance values for gate electrodes, resistors, and capacitor plates Chih-Heng Shen, Huan-Wen Wang, Ying-Tzu Yen 2000-11-07
6093629 Method of simplified contact etching and ion implantation for CMOS technology 2000-07-25
6077776 Polysilicon residue free process by thermal treatment Ching-Wen Cho, Cheng-Fu Hsu, Po-Tao Chu 2000-06-20
6071826 Method of manufacturing CMOS image sensor leakage free with double layer spacer Ching-Wen Cho, Hua Yang, Chih-Heng Shen, Wen-Cheng Chien, Chang-Jen Wu +2 more 2000-06-06
6001538 Damage free passivation layer etching process Jie Wu, Fang Chen, Tsung Tser Lee 1999-12-14
5904570 Method for polymer removal after etching Bao Ru Yang, Wen-Cheng Chang, Heng-Hsin Liu 1999-05-18
5763316 Substrate isolation process to minimize junction leakage Bao Ru Yang, Wen-Cheng Chang 1998-06-09
5719087 Process for bonding pad protection from damage Jie Wu, Po-Tau Chu, Wen-Cheng Chang 1998-02-17
5639342 Method of monitoring and controlling a silicon nitride etch step Wen-Cheng Chang, Heng-Hsin Liu, Bao Ru Yang 1997-06-17
5633210 Method for forming damage free patterned layers adjoining the edges of high step height apertures Bao Ru Yang, Wen-Cheng Chang, Po-Tau Chu 1997-05-27