Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5719087 | Process for bonding pad protection from damage | Sen-Fu Chen, Jie Wu, Wen-Cheng Chang | 1998-02-17 |
| 5633210 | Method for forming damage free patterned layers adjoining the edges of high step height apertures | Bao Ru Yang, Sen-Fu Chen, Wen-Cheng Chang | 1997-05-27 |