Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6682659 | Method for forming corrosion inhibited conductor layer | Kuwi-Jen Chang, Sen-Fu Chen, Kuang-Peng Lin, Shing-Jzy Tay, Szu-Hung Yang +6 more | 2004-01-27 |
| 6660624 | Method for reducing fluorine induced defects on a bonding pad surface | Jiann-Tyng Tzeng, Jih-Ren Tsai, Michael Wu | 2003-12-09 |
| 6627475 | Buried photodiode structure for CMOS image sensor | Hua Yang, Chih-Heng Shen | 2003-09-30 |
| 6624466 | Implant method for forming Si3N4 spacer | Sen-Fu Chen, Huan-Wen Wang, Chih-Heng Shen | 2003-09-23 |
| 6620683 | Twin-bit memory cell having shared word lines and shared bit-line contacts for electrically erasable and programmable read-only memory (EEPROM) and method of manufacturing the same | Boson Lin, David Ho | 2003-09-16 |
| 6380030 | Implant method for forming Si3N4 spacer | Sen-Fu Chen, Huan-Wen Wang, Chih-Heng Shen | 2002-04-30 |
| 6157867 | Method and system for on-line monitoring plasma chamber condition by comparing intensity of certain wavelength | Yuan-Ko Hwang | 2000-12-05 |
| 6077776 | Polysilicon residue free process by thermal treatment | Cheng-Fu Hsu, Sen-Fu Chen, Po-Tao Chu | 2000-06-20 |
| 6071826 | Method of manufacturing CMOS image sensor leakage free with double layer spacer | Hua Yang, Sen-Fu Chen, Chih-Heng Shen, Wen-Cheng Chien, Chang-Jen Wu +2 more | 2000-06-06 |
| 6006764 | Method of stripping photoresist from Al bonding pads that prevents corrosion | Po-Tao Chu, Chia-Hung Lai, Chih-Chien Hung | 1999-12-28 |