Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094579 | Method of forming shallow trench isolation structure | Yen-Bin Huang, Chien-Mao Chen, Yu-Hsuan Kuo, Shih-Kai Fan, Kang-Min Kuo | 2021-08-17 |
| 10871720 | Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor wafer | Astha Sharma, Hsin-Kuo Chang, Jaw-Lih Shih, Hong-Hsing Chou | 2020-12-22 |
| 10699938 | Shallow trench isolation structure and method of forming the same | Yen-Bin Huang, Chien-Mao Chen, Yu-Hsuan Kuo, Shih-Kai Fan, Kang-Min Kuo | 2020-06-30 |
| 9269257 | Method and system for reminding reader of fatigue in reading while using electronic device | Yueh-Min Huang, CHIA-JU LIU, YEN-NING SU, Chia-Cheng Hsu, Yu-Cheng Chien +4 more | 2016-02-23 |
| 9066566 | Transparent shell structure for luggage and the like | — | 2015-06-30 |
| 8461857 | Distance adjustment system for use in solar wafer inspection machine and inspection machine provided with same | — | 2013-06-11 |
| 7160811 | Laminated silicate glass layer etch stop method for fabricating microelectronic product | Yen-Ming Chen, Huan Chi Tseng, Yu-Hua Lee, Dian-Hau Chen, Kang-Min Kuo | 2007-01-09 |
| 7056821 | Method for manufacturing dual damascene structure with a trench formed first | Chin-Tien Yang, Juan-Jann Jou, Yu-Hua Lee | 2006-06-06 |
| 7015129 | Bond pad scheme for Cu process | Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Huan Chi Tseng, Yu-Hua Lee +1 more | 2006-03-21 |
| 6844626 | Bond pad scheme for Cu process | Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Huan Chi Tseng, Yu-Hua Lee +1 more | 2005-01-18 |
| 6006764 | Method of stripping photoresist from Al bonding pads that prevents corrosion | Po-Tao Chu, Ching-Wen Cho, Chih-Chien Hung | 1999-12-28 |