HT

Huan Chi Tseng

TSMC: 19 patents #1,728 of 12,232Top 15%
Overall (All Time): #236,894 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
11150296 Method and apparatus for testing a semiconductor device Szu-Chia Huang, Jhih Jie Shao, Tang-Hsuan Chung 2021-10-19
10520545 Method and apparatus for testing a semiconductor device Szu-Chia Huang, Jhih Jie Shao, Tang-Hsuan Chung 2019-12-31
9995770 Multidirectional semiconductor arrangement testing Tseng Chin Lo, Kuo-Chuan Chang, Yuan-Yao Chang, Chien-Chang Lee 2018-06-12
9639647 Method of making semiconductor device and system for performing the same Chung-Min Fu, Wan-Yu Lo, Chin-Chou Liu 2017-05-02
9459316 Method and apparatus for testing a semiconductor device Szu-Chia Huang, Jhih Jie Shao, Tang-Hsuan Chung 2016-10-04
9151798 Method and apparatus for testing a semiconductor device Jhih Jie Shao, Tang-Hsuan Chung, Szu-Chia Huang, Chien-Chang Lee, Yu-Lan Hsiao 2015-10-06
9075101 Method and apparatus for testing a semiconductor device Jhih Jie Shao, Szu-Chia Huang, Tang-Hsuan Chung 2015-07-07
8978003 Method of making semiconductor device and a control system for performing the same Chung-Min Fu, Wan-Yu Lo, Chin-Chou Liu 2015-03-10
8674355 Integrated circuit test units with integrated physical and electrical test regions Heng-Hsin Liu, Shu-Cheng Kuo, Chien-Chang Lee, Chun-Hung Lin 2014-03-18
8531201 Method and apparatus for testing a semiconductor device Jhih Jie Shao, Szu-Chia Huang, Tang-Hsuan Chung 2013-09-10
8499274 Computer implemented system and method for leakage calculation Chien-Ju Chao, Jerry Chang Jui Kao, King-Ho Tam, Chung-Hsing Wang 2013-07-30
7545045 Dummy via for reducing proximity effect and method of using the same Kun Huang, Jhy-Chen You, Kuan-Miao Liu, Tsong-Yuan Chen, Chih-Yang Wang +2 more 2009-06-09
7160811 Laminated silicate glass layer etch stop method for fabricating microelectronic product Yen-Ming Chen, Yu-Hua Lee, Dian-Hau Chen, Chia-Hung Lai, Kang-Min Kuo 2007-01-09
7015129 Bond pad scheme for Cu process Chia-Hung Lai, Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Yu-Hua Lee +1 more 2006-03-21
6943062 Contaminant particle removal by optical tweezers Hong-Miao Chen, Yu-Chang Jong 2005-09-13
6844626 Bond pad scheme for Cu process Chia-Hung Lai, Jiunn-Jyi Lin, Tzong-Sheng Chang, Min Cao, Yu-Hua Lee +1 more 2005-01-18
5990567 System for in-line monitoring of photo processing tilt in VLSI fabrication Chia-Hsiang Chen, Han-Liang Tseng 1999-11-23
5949547 System for in-line monitoring of photo processing in VLSI fabrication Chia-Hsiang Chen, Han-Liang Tseng 1999-09-07
5685947 Chemical-mechanical polishing with an embedded abrasive Ying-Chen Chao 1997-11-11