Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11989966 | Semiconductor devices and methods for forming the same | Hsin-Hui Lee, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2024-05-21 |
| 11621287 | Optical sensor device with reduced thickness and method for forming the same | Hsin-Hui Lee, Hsueh-Jung Lin | 2023-04-04 |
| 11482552 | Semiconductor devices and methods for forming the same | Hsin-Hui Lee, Hsueh-Jung Lin | 2022-10-25 |
| 11315964 | Optical sensors and methods for forming the same | Hsin-Hui Lee, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2022-04-26 |
| 11271024 | Semiconductor device and method for forming the same | Hsin-Hui Lee, Hsueh-Jung Lin, Chin-Cheng Li | 2022-03-08 |
| 11177397 | Semiconductor devices and methods for forming the same | Hsin-Hui Lee, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2021-11-16 |
| 11152422 | Semiconductor devices and methods for forming the same | Hsin-Hui Lee, Hsueh-Jung Lin, Chin-Cheng Li | 2021-10-19 |
| 11049771 | Semiconductor device and fingerprint identification device | Hsin-Hui Lee, Hsueh-Jung Lin | 2021-06-29 |
| 10935805 | Optical sensor and method for forming the same | Hsin-Hui Lee, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2021-03-02 |
| 10915727 | Optical sensor and method for forming the same | Hsin-Hui Lee, Hsueh-Jung Lin | 2021-02-09 |
| 10770602 | Optical sensor and method for forming the same | Hsin-Hui Lee, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2020-09-08 |
| 10763288 | Semiconductor device and method for forming the same | Hsin-Hui Lee, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2020-09-01 |
| 10699092 | Optical sensor and manufacturing method thereof | Hsin-Hui Lee | 2020-06-30 |
| 10651218 | Optical sensor structure and method for forming the same | Hsin-Hui Lee, Hsueh-Jung Lin | 2020-05-12 |
| 8049323 | Chip holder with wafer level redistribution layer | Chen-Shien Chen, Chao-Hsiang Yang, Jimmy Liang, Mirng-Ji Lii, Tjandra Winata Karta +1 more | 2011-11-01 |
| 7662665 | Method for fabricating a semiconductor package including stress relieving layer for flip chip packaging | Chen-Shien Chen, Kuo-Chin Chang, Szu-Wei Lu, Pei-Haw Tsao, Chung Yu Wang +1 more | 2010-02-16 |
| 6710889 | Method for improved dielectric layer metrology calibration | Pey-Yuan Lee, Chi-Shen Lo, Sian-Ren Horng, Wei-Ming You, Yi-Hung Chen | 2004-03-23 |
| 6004864 | Ion implant method for forming trench isolation for integrated circuit devices | Ji-Chung Huang, Chia-Hsiang Chen, Kuo-Sheng Chuang | 1999-12-21 |
| 6001540 | Microlens process | Ji-Chung Huang, Yea-Dean Sheu, Chung-En Hsu | 1999-12-14 |
| 5990567 | System for in-line monitoring of photo processing tilt in VLSI fabrication | Huan Chi Tseng, Chia-Hsiang Chen | 1999-11-23 |
| 5949547 | System for in-line monitoring of photo processing in VLSI fabrication | Huan Chi Tseng, Chia-Hsiang Chen | 1999-09-07 |
| 5530418 | Method for shielding polysilicon resistors from hydrogen intrusion | Shun-Liang Hsu, Mou-Shiung Lin | 1996-06-25 |