Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094792 | Package structure having lid with protrusion and manufacturing method thereof | Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin | 2024-09-17 |
| 12021048 | Semiconductor device | Chien-Hao Hsu, Yen-Kun Lai, Wei-Hsiang Tu, Hao-Chun Liu, Mirng-Ji Lii | 2024-06-25 |
| 12009327 | Semiconductor die | Yen-Kun Lai, Chien-Hao Hsu, Wei-Hsiang Tu, Mirng-Ji Lii | 2024-06-11 |
| 11855022 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2023-12-26 |
| 11848270 | Chip structure and method for forming the same | Hong-Seng Shue, Sheng-Han Tsai, Mirng-Ji Lii, Kuo-Ching Hsu | 2023-12-19 |
| 11532583 | Semiconductor structure and manufacturing method thereof | Yen-Kun Lai, Kuo-Ching Hsu, Mirng-Ji Lii | 2022-12-20 |
| 11495556 | Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same | Pei-Haw Tsao, An Xu, Huang-Ting Hsiao | 2022-11-08 |
| 11450588 | Method for forming chip package structure with heat conductive layer | Shin CHI, Chien-Hao Hsu, Cheng-Nan Lin, Mirng-Ji Lii | 2022-09-20 |
| 11380639 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2022-07-05 |
| 11222859 | Semiconductor device structure with bonding pad and method for forming the same | Chien-Hao Hsu, Wei-Hsiang Tu, Mirng-Ji Lii | 2022-01-11 |
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Chih-Fan Huang, Mao-Nan Wang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-11-30 |
| 11145564 | Multi-layer passivation structure and method | Chih-Fan Huang, Hui-Chi Chen, Dian-Hau Chen, Yen-Ming Chen | 2021-10-12 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Pei-Haw Tsao, Chen-Shien Chen, Cheng-Hung Tsai, Li-Huan Chu | 2021-09-21 |
| 11018099 | Semiconductor structure having a conductive bump with a plurality of bump segments | Pei-Haw Tsao, An Xu, Huang-Ting Hsiao | 2021-05-25 |
| 10985124 | Semiconductor structure and manufacturing method thereof | Yen-Kun Lai, Kuo-Ching Hsu, Mirng-Ji Lii | 2021-04-20 |
| 10861810 | Shielding structures | Chih-Fan Huang, Hui-Chi Chen, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2020-12-08 |
| 10157831 | Semiconductor device having a conductive via structure | Yuh Chern Shieh | 2018-12-18 |
| 9514978 | Method of forming semiconductor device having a conductive via structure | Yuh Chern Shieh | 2016-12-06 |
| 9159638 | Conductive via structure | Yuh Chern Shieh | 2015-10-13 |
| 9136211 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsun Lee, Pei-Haw Tsao, Chung-Yi Lin, Bill Kiang | 2015-09-15 |
| 8976529 | Lid design for reliability enhancement in flip chip package | Wen-Yi Lin, Po-Yao Lin, Tsung-Shu Lin, Shou-Yi Wang | 2015-03-10 |
| 8704383 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Tjandra Winata Karta, Jerry Tzou | 2014-04-22 |
| 8519535 | Method and structure for controlling package warpage | Tsung-Shu Lin, Yuh Chern Shieh | 2013-08-27 |
| 8492263 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Chien-Hsiun Lee, Pei-Haw Tsao, Chung-Yi Lin, Bill Kiang | 2013-07-23 |
| 8174129 | Silicon-based thin substrate and packaging schemes | Szu-Wei Lu, Clinton Chao, Ann Luh, Tjandra Winata Karta, Jerry Tzou | 2012-05-08 |