Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237226 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Pei-Haw Tsao | 2025-02-25 |
| 12205859 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2025-01-21 |
| 12159847 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Tsung-Jen Liao, Pei-Haw Tsao | 2024-12-03 |
| 12051624 | Stacked semiconductor devices and methods of forming thereof | Tsung-Hsing Lu, Jun He, Pei-Haw Tsao | 2024-07-30 |
| 12016126 | Carrier tape system and components and methods of use | Sung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin | 2024-06-18 |
| 11990423 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Pei-Haw Tsao | 2024-05-21 |
| 11742276 | Semiconductor package and manufacturing process thereof | Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
| 11610827 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2023-03-21 |
| 11527499 | Integrated fan-out structures and methods for forming the same | Tsui-Mei Chen, Tsung-Jen Liao, Pei-Haw Tsao | 2022-12-13 |
| 11404383 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Pei-Haw Tsao | 2022-08-02 |
| 11342291 | Semiconductor packages with crack preventing structure | Yao-Chun Chuang, Hong-Seng Shue, Chen-Nan Chiu, Mirng-Ji Lii | 2022-05-24 |
| 11315860 | Semiconductor package and manufacturing process thereof | Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
| 11239143 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao, Tsung-Hsing Lu | 2022-02-01 |
| 11240947 | Carrier tape system and components and methods of use | Sung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin | 2022-02-01 |
| 11127704 | Semiconductor device with bump structure and method of making semiconductor device | Pei-Haw Tsao, Chen-Shien Chen, Cheng-Hung Tsai, Kuo-Chin Chang | 2021-09-21 |
| 11101190 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2021-08-24 |
| 11081392 | Dicing method for stacked semiconductor devices | Tsung-Hsing Lu, Jun He, Pei-Haw Tsao | 2021-08-03 |
| 10912194 | Printed circuit board | Pei-Haw Tsao, Tsung-Hsing Lu | 2021-02-02 |
| 10892230 | Magnetic shielding material with insulator-coated ferromagnetic particles | Tsung-Hsing Lu, Pei-Haw Tsao | 2021-01-12 |
| 10867881 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2020-12-15 |
| 10692828 | Package structure with protrusion structure | Pei-Haw Tsao, Chen-Shien Chen | 2020-06-23 |
| 10510633 | Package and printed circuit board attachment | Pei-Haw Tsao, Tsung-Hsing Lu | 2019-12-17 |
| 10506712 | Printed circuit board | Pei-Haw Tsao, Tsung-Hsing Lu | 2019-12-10 |
| 10373901 | Semiconductor structure and manufacturing method thereof | Pei-Haw Tsao, Tsung-Hsing Lu | 2019-08-06 |
| 10283424 | Wafer structure and packaging method | Tsui-Mei Chen, Pei-Haw Tsao, Cheng-Te Lin, Yu-Jung LIN | 2019-05-07 |