Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362246 | Interposer including stepped surfaces and methods of forming the same | Yu-Sheng Lin, Jyun-Lin Wu, Yao-Chun Chuang | 2025-07-15 |
| 11742276 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Kuen-Hong Tsai | 2023-08-29 |
| 11315860 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Tsung-Yang Hsieh, Kuen-Hong Tsai | 2022-04-26 |
| 9136442 | Multi-vertical LED packaging structure | Jui-Ping Weng, Hsiao-Wen Lee, Chun-Chih Chang, Min-Sheng Wu | 2015-09-15 |