Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424558 | Bridge die having different surface orientation than IC dies interconnected by the bridge die | Yu-Sheng Lin, Chin-Fu Kao, Jyun-Lin Wu, Yao-Chun Chuang | 2025-09-23 |
| 12261133 | Interposer with warpage-relief trenches | Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2025-03-25 |
| 11973040 | Interposer with warpage-relief trenches | Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo +1 more | 2024-04-30 |
| 11742276 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Hsin-Hsien Lee, Kuen-Hong Tsai | 2023-08-29 |
| 11315860 | Semiconductor package and manufacturing process thereof | Li-Huan Chu, Hsu-Hsien Chen, Liang-Chen Lin, Hsin-Hsien Lee, Kuen-Hong Tsai | 2022-04-26 |
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu +6 more | 2021-11-23 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu +6 more | 2021-08-24 |