Issued Patents All Time
Showing 1–25 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang +8 more | 2025-05-06 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2025-04-01 |
| 12243824 | Semiconductor devices and methods of manufacture | Shang-Yun Hou | 2025-03-04 |
| 12148719 | Forming large chips through stitching | Wen-Hsin Wei, Shang-Yun Hou, Weiming Chris Chen | 2024-11-19 |
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsuan-Ning Shih, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 12021006 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei | 2024-06-25 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang +8 more | 2024-06-18 |
| 11996371 | Chiplet interposer | Shang-Yun Hou, Weiming Chris Chen, Kuo-Chiang Ting, Wen-Chih Chiou, Chen-Hua Yu | 2024-05-28 |
| 11967546 | Giga interposer integration through Chip-On-Wafer-On-Substrate | Shang-Yun Hou, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2024-04-23 |
| 11923310 | Package structure including through via structures | Chih-Kai Cheng, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-03-05 |
| 11854990 | Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die | Chen-Hua Yu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2023-12-26 |
| 11854983 | Semiconductor devices and methods of manufacture | Shang-Yun Hou | 2023-12-26 |
| 11830745 | 3D packages and methods for forming the same | Tzu-Wei Chiu, Cheng-Hsien Hsieh, Kuo-Ching Hsu, Shang-Yun Hou, Shin-Puu Jeng | 2023-11-28 |
| 11810833 | Package structure and method and equipment for forming the same | Wensen Hung, Tsung-Yu Chen, Tsung-Shu Lin, Chen-Hsiang Lao, Wen-Hsin Wei | 2023-11-07 |
| 11728254 | Giga interposer integration through chip-on-wafer-on-substrate | Shang-Yun Hou, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen +5 more | 2023-08-15 |
| 11682593 | Interposer test structures and methods | Tzuan-Horng Liu, Chen-Hua Yu, Tzu-Yu Wang, Wei-Cheng Wu, Shang-Yun Hou +1 more | 2023-06-20 |
| 11569172 | Semiconductor devices and methods of manufacture | Shang-Yun Hou | 2023-01-31 |
| 11527454 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-12-13 |
| 11456287 | Package structure and method of fabricating the same | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu, Wen-Hsin Wei, Chih-Chien Pan | 2022-09-27 |
| 11444038 | Forming large chips through stitching | Wen-Hsin Wei, Shang-Yun Hou, Weiming Chris Chen | 2022-09-13 |
| 11417580 | Package structures and methods of forming the same | Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin +2 more | 2022-08-16 |
| 11183399 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-11-23 |
| 11169207 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Chen-Hua Yu, Chao-Hsiang Yang | 2021-11-09 |
| 11101140 | Semiconductor device and method of manufacture | Wen-Hsin Wei, Shang-Yun Hou, Chi-Hsi Wu, Chen-Hua Yu, Wen-Jung Chuang +6 more | 2021-08-24 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Yushun Lin, Heh-Chang Huang +8 more | 2021-08-24 |